工厂常见英语单词(17页).doc

上传人:1595****071 文档编号:37417756 上传时间:2022-08-31 格式:DOC 页数:17 大小:302KB
返回 下载 相关 举报
工厂常见英语单词(17页).doc_第1页
第1页 / 共17页
工厂常见英语单词(17页).doc_第2页
第2页 / 共17页
点击查看更多>>
资源描述

《工厂常见英语单词(17页).doc》由会员分享,可在线阅读,更多相关《工厂常见英语单词(17页).doc(17页珍藏版)》请在得力文库 - 分享文档赚钱的网站上搜索。

1、-工厂常见英语单词-第 17 页从事质量工作以来积累的常用英语,希望对有需要的朋友有所帮助!质量专业英语大全零件材料类的专有名词CPU: central processing unit(中央处理器)IC: Integrated circuit(集成电路)Memory IC: Memory Integrated circuit(记忆集成电路)RAM: Random Access Memory(随机存取内存)DRAM: Dynamic Random Access Memory(动态随机存取内存)SRAM: Staic Random Access Memory(静态随机内存)ROM: Read-on

2、ly Memory(只读存储器)EPROM:Electrical Programmable Read-only Memory(电可抹只读存诸器)EEPROM: Electrical Erasbale Programmable Read-only Memory(电可抹可编程只读存储器)CMOS: Complementary Metal-Oxide-Semiconductor(互补金属氧化物半导体)BIOS: Basic Input Output System(基本输入输出系统)Transistor:晶体管LED:发光二极管Resistor:电阻Variator:可变电阻Capacitor:电容C

3、apacitor array:排容Diode:二极管Transistor:三极体Transformer:变压器(ADP)Oscillator:频率振荡器(0sc)Crystal:石英振荡器XTAL/OSC:振荡产生器(X)Relay:延时器Sensor:感应器Bead core:磁珠Filter:滤波器Flat Cable:排线Inductor:电感Buzzer:蜂鸣器Socket:插座Slot:插槽Fuse:熔断器Current:电流表Solder iron:电烙铁Magnifying glass:放大镜Caliper:游标卡尺Driver:螺丝起子Oven:烤箱TFT:液晶显示器Oscil

4、loscope:示波器Connector:连接器PCB:printed circuit board(印刷电路板)PCBA: printed circuit board assembly(电路板成品)PP:并行接口HDD:硬盘FDD:软盘PSU:power supply unit(电源供应器)SPEC:规格Attach:附件Case: 机箱,盖子Cover:上盖Base:下盖Bazel:面板(panel)Bracket:支架,铁片Lable:贴纸Guide:手册Manual:手册,指南Card:网卡Switch:交换机Hub:集线器Router:路由器Sample:样品Gap:间隙Sponge:

5、海绵Pallet:栈板Foam:保利龙Fiber:光纤Disk:磁盘片PROG:程序Barcode:条形码System:系统System Barcode:系统条形码M/B:mother board:主板CD-ROM:光驱FAN:风扇Cable:线材Audio:音效K/B:Keyboard(键盘)Mouse:鼠标Riser card:转接卡Card reader:读卡器Screw:螺丝Thermal pad:散热垫Heat sink:散热片Rubber:橡胶垫Rubber foot:脚垫Bag:袋子Washer:垫圈Sleeve:袖套Config:机构Label hi-pot:高压标签Firmw

6、are label:烧录标签Metal cover:金属盖子Plastic cover:塑料盖子Tape for packing:包装带Bar code:条形码Tray:托盘Collecto:集线夹Holder:固定器,L铁Connecter:连接器IDE:集成电路设备,智能磁盘设备SCSI:小型计算机系统接口Gasket:导电泡棉AGP:加速图形接口PCI:周边组件扩展接口LAN:局域网USB:通用串形总线架构Slim:小型化COM:串型通讯端口LPT:打印口,并行口Power cord:电源线I/O:输入,输出Speaker:扬声器EPE:泡棉Carton:纸箱Button:按键,按钮Fo

7、ot stand:脚架部门名称的专有名词QSuality system质量系统CS:Coutomer Sevice 客户服务QCuality control质量管理IQC:Incoming quality control 进料检验LQCine Quality Control 生产线质量控制IPQC:In process quality control 制程检验FQC:Final quality control 最终检验OQC:Outgoing quality control 出货检验QAuality assurance 质量保证SQA:Source(supplier) Quality Assu

8、rance 供货商质量保证(VQA)CQA:Customer Quality Assurance客户质量保证PQArocess Quality Assurance 制程质量保证QEuality engineer 质量工程CE:component engineering零件工程EE:equipment engineering设备工程ME:manufacturing engineering制造工程TE:testing engineering测试工程PPEroduct Engineer 产品工程IE:Industrial engineer 工业工程ADM: Administration Depart

9、ment行政部RMA:客户退回维修CSDI:检修PC:producing control生管MC:mater control物管GAD: General Affairs Dept总务部A/D: Accountant /Finance Dept会计LAB: Laboratory实验室DOE:实验设计HR:人资PMC:企划RD:研发W/H:仓库SI:客验PD: Product Department生产部PA:采购(PUR: Purchaing Dept)SMT:Surface mount technology 表面粘着技术MFG:Manufacturing 制造MIS:Management inf

10、ormation system 资迅管理系统DCC:document control center 文件管制中心厂内作业中的专有名词QTuality target质量目标QPuality policy目标方针QI:Quality improvement质量改善CRITICAL DEFECT:严重缺点(CR)MAJOR DEFECT:主要缺点(MA)MINOR DEFECT:次要缺点(MI)MAX:Maximum最大值MIN:Minimum最小值DIAiameter直径DIMimension尺寸LCLower control limit管制下限UCL:Upper control limit管制上

11、限EMI:电磁干扰ESD:静电防护EPA:静电保护区域ECN:工程变更ECO:Engineering change order工程改动要求(客户)ECR:工程变更需求单CPI:Continuous Process Improvement 连续工序改善Compatibility:兼容性Marking:标记DWGrawing图面Standardization:标准化Consensus:一致Code:代码ZD:Zero defect零缺点Tolerance:公差Subject matter:主要事项Auditor:审核员BOM:Bill of material物料清单Rework:重工ID:iden

12、tification识别,鉴别,证明PILOT RUN: (试投产)FAI:首件检查FPIR:First Piece Inspection Report首件检查报告FAA:首件确认SPC:统计制程管制CP: capability index(准确度)CPK: capability index of process(制程能力)PMP:制程管理计划(生产管制计划)MPI:制程分析DASefects Analysis System 缺陷分析系统PPB:十亿分之一Flux:助焊剂P/N:料号L/N:Lot Number批号Version:版本Quantity:数量Valid date:有效日期MIL-

13、STD:Military-Standard军用标准ICT: In Circuit Test (线路测试)ATE:Automatic Test Equipment自动测试设备MO: Manafacture Order生产单T/U: Touch Up (锡面修补)I/N:手插件P/T:初测F/T: Function Test (功能测试-终测)AS组立P/K:包装TQM:Total quality control全面质量管理MDA:manufacturing defect analysis制程不良分析(ICT)RUN-IN:老化实验HI-pot:高压测试FMI:Frequency Modulati

14、on Inspect高频测试DPPM: Defect Part Per Million (不良率的一种表达方式:百万分之一) 1000PPM即为0.1%Corrective Action: (CAR改善对策)ACC:允收REJ:拒收S/S:Sample size抽样检验样本大小SI-SIV:Special I-Special IV特殊抽样水平等级CON:Concession / Waive特采ISO:国际标准化组织ISA:Industry Standard Architecture工业标准体制结构OBA:开箱稽核FIFO:先进先出PDCA:管理循环Plan do check action计划,

15、执行,检查,总结WIP:在制品(半成品)S/O: Sales Order (业务订单)P/O: Purchase Order (采购订单)P/R: Purchase Request (请购单)AQL:acceptable quality level允收质量水平LQL;Limiting quality level最低质量水平QVL:qualified vendor list合格供货商名册AVL :认可的供货商清单(Approved Vendor List)QCD: Quality cost delivery(质量,交期,成本)MPM:Manufacturing project managemen

16、t制造项目管理KPI:Key performance indicate重要绩效指标MVT:Manufacturing Verification Test制造验证试产Q/R/S:Quality/Reliability/Service质量/可靠度/服务STL:ship to line(料到上线)NTF:No trouble found误判CIP:capacity improvement plan(产能改善计划)MRB:material review board(物料审核小组)MRB:Material reject bill退货单JIT:just in time(实时管理)5S:seiri seit

17、on seiso seiketsu shitsuke(整理,整顿,清扫,清洁,修养)SOP:standard operation process(标准作业程序)SIP:Specification inspection process制程检验规格TOP: Test Operation Process (测试作业流程)WI: working instruction(作业指导书)SMD:surface mounting device(表面粘着原件)FAR:failure aualysis report故障分析报告CAR:Corrective action report改善报告BPR: 企业流程再造

18、(Business Process Reengineering)ISAR :首批样品认可(Initial Sample Approval Request)-JIT:实时管理 (Just In Time)QCC :品管圈 (Quality Control Circle)Engineering Department (工程部)TQEM: Total Quality Environment Management(全面质量环境管理)PD: Production Department (制造)LOG: Logistics (后勤支持) Shipping: (进出口)AOQ:Average Output

19、Quality平均出货质量AOQL:Average Output Quality Level平均出货质量水平FMEA:failure model effectiveness analysis失效模式分析CRB: Change Review Board (工程变更会议)CSA:Customer Simulate Analysis客户模拟分析SQMS:Supplier Quality Management System供货商质量管理系统QIT: Quality Improvement Team 质量改善小组QIP:Quality Improvement Plan质量改善计划CIP:Continua

20、l Improvement Plan持续改善计划M.Q.F.S: Material Quality Feedback Sheet (来料质量回馈单)SCAR: Supplier Corrective Action Report (供货商改善对策报告)8D Sheet: 8 Disciplines sheet ( 8D单)PDCA:PDCA (Plan-Do-Check-Action) (管理循环)MPQ: Material Packing Quantity (物料最小包装量)DSCN: Delivery Schedule Change Notice (交期变更通知)QAPS: Quality

21、Assurance Process Sheet (质量工程表)DRP :运销资源计划 (Distribution Resource Planning)DSS:决策支持系统 (Decision Support System)EC :电子商务 (Electronic Commerce)EDI :电子数据交换 (Electronic Data Interchange)EIS :主管决策系统 (Excutive Information System) :企业资源规划 (Enterprise Resource Planning)FMS :弹性制造系统 (Flexible Manufacture Syst

22、em)KM :知识管理 (Knowledge Management)4L :逐批订购法 (Lot-for-Lot)LTC :最小总成本法 (Least Total Cost)LUC :最小单位成本 (Least Unit Cost)MES :制造执行系统 (Manufacturing Execution System)MPS :主生产排程 (Master Production Schedule)MRP :物料需求规划 (Material Requirement Planning)MRP:制造资源计划 (Manufacturing Resource Planning)OEM :委托代工 (Ori

23、ginal Equipment Manufacture)ODM :委托设计与制造 (Original Design & Manufacture)OLAP:在线分析处理 (On-Line Analytical Processing)OLTP:在线交易处理 (On-Line Transaction Processing)OPT :最佳生产技术 (Optimized Production Technology)PDCA:PDCA管理循环 (Plan-Do-Check-Action)PDM:产品数据管理系统 (Product Data Management)RCCP:粗略产能规划 (Rough Cut

24、 Capacity Planning)SCM :供应链管理 (Supply Chain Management)SFC :现场控制 (Shop Floor Control)TOC:限制理论 (Theory of Constraints)TQC :全面质量管理 (Total Quality Control)FYI/R:for your information/reference仅供参考ASAP:尽快S/T:Standard time标准时间TPM:total production maintenance:全面生产保养ESD Wrist strap:静电环IT:information technology信息技术,信息科学CEO:Chief Executive Officer执行总裁COO:Chief Operaring Officer首席业务总裁SWOT:Strength,Weakness,Opportunity,Threat优势弱点机会威胁Competence:专业能力Communication:有效沟通转自: url=

展开阅读全文
相关资源
相关搜索

当前位置:首页 > 教育专区 > 高考资料

本站为文档C TO C交易模式,本站只提供存储空间、用户上传的文档直接被用户下载,本站只是中间服务平台,本站所有文档下载所得的收益归上传人(含作者)所有。本站仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。若文档所含内容侵犯了您的版权或隐私,请立即通知得利文库网,我们立即给予删除!客服QQ:136780468 微信:18945177775 电话:18904686070

工信部备案号:黑ICP备15003705号-8 |  经营许可证:黑B2-20190332号 |   黑公网安备:91230400333293403D

© 2020-2023 www.deliwenku.com 得利文库. All Rights Reserved 黑龙江转换宝科技有限公司 

黑龙江省互联网违法和不良信息举报
举报电话:0468-3380021 邮箱:hgswwxb@163.com