PCBA外观检验标准规定.ppt

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1、,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度 (組件X方向) SMD Assembly workmanship criteria-Chip component alignment( X Axis),1. 晶片狀零件恰能座落在焊 墊的中央且未發生偏出， 所有各金屬封頭都能完全 與焊墊接觸。 1.Component is centered on both sides of the land . All the solder terminations shall completely touch

2、pad.,1.零件橫向超出焊墊以外，但 尚未大於其零件寬度的50% 。(X1/2W) 1.The component shifted off the pad and shift length shall less 1/2 chip width,1.零件已橫向超出焊墊，大 於零件寬度的50%(MI)。 (X1/2W) 1.The component shifted off the pad and shift length over 1/2 chip with,允收狀況(Accept Condition),X1/2W X1/2W,330,X1/2W X1/2W,註:此標準適用於三面或五面 之晶片狀

3、零件 This standard only be used for 3 or 5 face terminations chip component,w,w,330,330,理想狀況(Target Condition),拒收狀況(Reject Condition),1.晶片狀零件恰能座落在焊墊 的中央且未發生偏出，所有 各金屬封頭都能完全與焊墊 接觸。 1.Component is centered on both sides of the land . All the solder terminations shall completely touch pad.,1.零件縱向偏移，但焊墊尚保

4、有其零件寬度的25%以上。 (Y1 1/4W) 2.零件縱向偏移，但零件端電 極仍蓋住焊墊為其零件寬度 的25%以上。 (Y2 1/4W) Component is shifted towards longest part of the chip , but the termiuad end of chip still on the land 1.The Pad length not be cover by chip (Y1) shall over 1/4 chip width (W) 2.1/4 width of the land for solder fillet to form.,1.零

5、件縱向偏移，但焊墊未 保有其零件寬度的25%(MI) 。(Y11/4W) 2.零件縱向偏移，但零件端 電極蓋住焊墊小於其零件 寬度的25%。 (Y21/4W) 3.Whichever is rejected .,允收狀況(Accept Condition),W W,330,330,Y2 1/4W,330,Y1 1/4W,Y2 1/4W,Y1 1/4W,SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度 (組件Y方向) SMD Assembly workmanship criteria-Chip component alignment( Y Axis),理想狀況(Target Conditi

6、on),拒收狀況(Reject Condition),SMT零件組裝工藝標準-圓筒形（Cylinder）零件之對準度 SMD Assembly workmanship criteria-Cylinder component alignment,1.組件的接觸點在焊墊中心 1.The point of contact is centered on the lands,1.組件端寬(短邊)突出焊墊端 部份是組件端直徑33%以下。 (X 1/3D) 2.零件縱向偏移，但金屬封頭仍 在焊墊上。 (Y10 mil),(Y20 mil) 1.The length of component shifted

7、off the pad(X) shall less the 1/3 Diameter of component 2.Shifted toward the longest part of the component , the solder terminations still on the land,1.組件端寬(短邊)突出焊墊端 部份是組件端直徑33%以上 (MI)。(X1/3D) 2.零件縱向偏移，但金屬封頭未 在焊墊上。 (Y10 mil),(Y20 mil) 3.Whichever is rejected .,允收狀況(Accept Condition),X1/3D X1/3D Y20

8、mil Y10mil,X1/3D X1/3D Y20 mil Y10 mil,註：為明瞭起見,焊點上的錫已 省去。 Note:In order to clarify the figure , the solder joint be eliminated,D,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳面之對準度 SMD Assembly workmanship criteria-Gull-Wing footprint alignment,1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。

9、1.All the leads footprint is centered on the lands,1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過接腳本身寬度的1/2W 。(X1/2W ) 2.偏移接腳之邊緣與焊墊外 緣之垂直距離5mil (0.13mm)。(S5mil) 1.The length of the lead footprint shifted off the land(X)shall less 1/2 width of lead 2.The clearance(S)between lead shifted off and land shall over 5 mil,允

10、收狀況(Accept Condition),W S,X1/2W S5mil,X1/2W S5mil,1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，已超 過接腳本身寬度的1/2W (MI)。(X1/2W ) 2.偏移接腳之邊緣與焊墊外 緣之垂直距離5mil (0.13mm)(MI)。(S5mil) 3.Whichever is rejected .,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳趾之對準度 SMD Assembly workmanship criteria-Gull-Wing t

11、oe alingnment,1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。 1.All the leads footprint is centered on the lands,1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過焊墊側端外緣。 1.The lead had shifted and footprint not over the end of land,1.各接腳側端外緣，已 超過焊墊側端外緣(MI)。 1.The lead had shifted and footprint had over the end of land(MI),允收狀況(Accept Condit

12、ion),W W,已超過焊墊側端外緣,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳跟之對準度 SMD Assembly workmanship criteria-Gull-Wing heel alingnment,1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。 1.All the leads footprint is centered on the lands,1.各接腳已發生偏滑，腳跟 剩餘焊墊的寬度，最少保 有一個接腳厚度(XT)。 1.The lead had shifted t

13、he length from lead heel to end of land (X) shall be over the thickness of land (T),1.各接腳己發生偏滑，腳跟剩 餘焊墊的寬度，已小於接腳 厚度(XT)(MI)。,允收狀況(Accept Condition),T X,T X T,T XT,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面與腳跟焊點最小量 SMD solder joint workmanship criteria-Minimum solder of G

14、ull Wing footprint,1.引線腳的側面,腳跟吃錫良好 2.引線腳與板子焊墊間呈現凹面 焊錫帶。 3.引線腳的輪廓清楚可見。 1.side face and footprint have good solder fillet 2.concave fillet between land and lead 3.the shape(profile)of lead be clearly visible,1.引線腳的底邊與板子焊墊間的 銲錫帶至少涵蓋引線腳長的 2/3L以上。 2.腳跟(Heel)焊錫帶涵蓋高度h 大於零件腳1/2厚度。 (h1/2T) 。 3.腳跟(Heel)沾錫角需90

15、度。 1.Width of solder fillet between lead and land(X) shall over 2/3 lead footprint(L) 2.Minimum solder fillet flows up end more than 1/2 thickness of lead on heel 3.Wetting angle 90on heel,1.引線腳的底邊與板子焊墊間的 銲錫帶不足涵蓋引線腳長的 2/3L。 2.腳跟(Heel)焊錫帶涵蓋高 度 h小於零件腳1/2厚度。 (h1/2T) 。 3.腳跟(Heel)沾錫角90度。(MI) 4.Whichever

16、is rejected .,允收狀況(Accept Condition),L,X=2/3L,L,X2/3L,h1/2T,T,h1/2T,T,理想狀況(Target Condition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面焊點最大量 SMD solder joint workmanship criteria-Maximum solder of Gull Wing footprint,1.引線腳的側面,腳跟吃錫良好。 2.引線腳與板子焊墊間呈現凹面 焊錫帶。 3.引線腳的輪廓清楚可見。 1.side face and footprint have good solder fill

17、et 2.concave fillet between land and lead 3.the shape(profile)of lead be clearly visible,1.引線腳與板子焊墊間的焊錫連 接很好且呈一凹面焊錫帶。 2.引線腳的側端與焊墊間呈現稍 凸的焊錫帶。 3.引線腳的輪廓可見。 1.Good solder flow up and concave fillet between land and lead 2.Concave solder fillet between side face of lead and land 3.The shape (profile) of

18、lead (footprint) be clearly visible,1.焊錫帶延伸過引線腳的 頂部(MI)。 2.引線腳的輪廓模糊不清(MI)。 3.Whichever is rejected . 1.solder flow cover the end (TIP) of lead 2.The shape (profile) of lead not be visible clearly 3.Whichever is rejected,拒收狀況(Reject Condition),允收狀況(Accept Condition),理想狀況(Target Condition),拒收狀況(Reject

19、 Condition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳跟焊點最大量 SMD solder joint workmanship criteria-Minimum solder of Gull Wing Heel,1.腳跟的焊錫帶延伸到引線上彎 曲處底部(B)與下彎曲處頂部 (C)間的中心點。 註： ：引線上彎頂部 ：引線上彎底部 ：引線下彎頂部 ：引線下彎底部 1.Solder flow up to the center between B,C point on the heel of lead,1.腳跟的焊錫帶已延伸到引線 上彎曲處的底部(B)。 1.solder flow

20、 up to B point on the heel,1.腳跟的焊錫帶延伸到引線上 彎曲處的底部(B)，延伸過 高，且沾錫角超過90度，才 拒收(MI)。 1.Solder flow up over(cross) B point and the wetting angle over 90 degree,允收狀況(Accept Condition),沾錫角超過90度,A,B,D,C,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-J型接腳零件之焊點最小量 SMD solder joint workmanship criteria-

21、Minimum solder of J type lead,1.凹面焊錫帶存在於引線的四側 2.焊錫帶延伸到引線彎曲處兩側 的頂部(A,B)。 3.引線的輪廓清楚可見。 4.所有的錫點表面皆吃錫良好。 1.Solder concave fillet on the 4 face of lead 2.solder flow up to the angle high point A,B 3.Lead shape(profile)can be clearly visible 4.Good soldering joint at every solder contact,1.焊錫帶存在於引線的三側 2.焊

22、錫帶涵蓋引線彎曲處兩 側的50%以上(h1/2T)。 1.Solder concave fillet on the 3 face of lead 2.Height of solder flow-up on the lead angle(h) shall over 1/2 angle height(T),1.焊錫帶存在於引線的三側以 下(MI)。 2.焊錫帶涵蓋引線彎曲處兩側 的50%以下(h1/2T)(MI)。 3.Whichever is rejected . 1.Solder concave fillet is less 3 face 2.Height of solder flow-up

23、on the lead angle(h) under 1/2 angle height(T) 3.Whichever is rejected,允收狀況(Accept Condition),h1/2T,A,T B,h 1/2T,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準- J型腳零件對準度 SMD Assembly workmanship criteria-J type lead alignment,1.各接腳都能座落在焊墊的中 央，未發生偏滑。 1.All the leads footprint is centered o

24、n the lands,允收狀況(Accept Condition),S W,S5mil X1/2W,S1/2W,1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，已超 過接腳本身寬度的1/2W (MI)。(X1/2W ) 2.偏移接腳之邊緣與焊墊外 緣之垂直距離5mil (0.13mm)以下(MI)。 (S5mil) 3.Whichever is rejected .,1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過接腳本身寬度的1/2W 。(X1/2W ) 2.偏移接腳之邊緣與焊墊外 緣之垂直距離5mil (0.13mm)以上。(S5mil) The lead had shifted

25、off the land 1.The length of lead shifted off the land (X) shall less 1/2 width of lead (W) 2.The clearance distance between shifted lead and land edge shall over 5 mil,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-J型接腳零件之焊點最大量工藝水準點 SMD solder joint workmanship criteria-Maximum solder of

26、J type lead,1.凹面焊錫帶存在於引線的四側 2.焊錫帶延伸到引線彎曲處 兩側的頂部(A,B)。 3.引線的輪廓清楚可見。 4.所有的錫點表面皆吃錫良好。 1.Solder concave fillet on the 4 face of lead 2.solder flow up to the angle high point A,B 3.Lead shape(profile)can be clearly visible 4.Good soldering joint at every solder contact,1.凹面焊錫帶延伸到引線彎 曲處的上方,但在組件本 體的下方。 2.引

27、線頂部的輪廓清楚可見。 1.Solder flow up to top of lead angle and not touch the body 2.Shape(profile)of lead angle can be visible clearly,1.焊錫帶接觸到組件本體(MI)。 2.引線頂部的輪廓不清楚(MI)。 3.錫突出焊墊邊(MI)。 4.Whichever is rejected . 1.Solder had touched the body 2.Shape (profile) of lead angle can not be visible clearly 3.Excess

28、solder on the side of solder land,允收狀況(Accept Condition),A,B,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-晶片狀(Chip)零件之最小焊點(三面或五面焊點) SMD solder joint workmanship criteria-Minimum solder fillet of chip component( 3 or 5 face terminations),1.焊錫帶延伸到晶片端電極 高度的25%以上。 (h1/4T) 2.焊錫帶從晶片外端向外延 伸到焊墊的

29、距離為晶片高 度的25%以上。(X1/4H) 1.1/4 component height be fillet by solder at least 2.Solder flow spread on the land shall 1/4 width of component height at least , (Count from tip of component),1.焊錫帶延伸到晶片端電極 高度的25%以下(MI)。 (h1/4T) 2.焊錫帶從晶片外端向外延 伸到焊墊端的距離為晶片 高度的25%以下(MI)。 (X1/4T) 3.Whichever is rejected .,允收狀況(

30、Accept Condition),T,h1/4 T X1/4 T,h1/4 T X1/4 T,1.焊錫帶是凹面並且從晶片 端電極底部延伸到頂部的 2/3T以上。 2.錫皆良好地附著於所有可 焊接面。 1.Solder flow up from land (bottom of component solder termination to the 2/3 Height of component (T) 2.Good solder fillet on the all solder able terminations (face),理想狀況(Target Condition),拒收狀況(Rejec

31、t Condition),SMT焊點性工藝標準-晶片狀(Chip)零件之最大焊點(三面或五面焊點) SMD solder joint workmanship criteria-Maximum solder fillet of chip component ( 3 or 5 face terminations),1.焊錫帶稍呈凹面並且從晶 片端電極底部延伸到頂部 。 2.錫未延伸到晶片端電極頂 部的上方。 3.錫未延伸出焊墊端。 4.可看出晶片頂部的輪廓。 1.Solder concave fillet be formed from land to top of component 2.Sold

32、er do not overhang component 3.Solder do not spread out of land 4. Shape (profile) of component termination be visible,1.錫已超越到晶片頂部的上方 (MI) 。 2.錫延伸出焊墊端(MI)。 3.看不到晶片頂部的輪廓(MI) 。 4.Whichever is rejected .,允收狀況(Accept Condition),H,1.焊錫帶是凹面並且從晶片 端電極底部延伸到頂部的 2/3H以上。 2.錫皆良好地附著於所有可 焊接面。 1.Solder flow up from

33、 land (bottom of component solder termination to the 2/3 Height of component (T) 2.Good solder fillet on the all solder able terminations (face),理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊錫性工藝標準-焊錫性問題 (錫珠、錫渣) SMD solder joint workmanship criteria-Other solder issue ( solder ball , solder dros

34、s),1.無任何錫珠、錫渣殘留於 PCB。 1.No solder ball and solder dross leave on PCB,1.錫珠、錫渣不論可被剝除者 或不易被剝除者,直徑D或長 度L10mil。(D,L10mil) 1.The diameter of solder ball / solder dross which can remove or not shall small than 10 mil,1.錫珠、錫渣不論可被剝除者 或不易被剝除者,直徑D或長 度L10mil。(D,L10mil)(MI) 且10mil每平方英寸不得超過5顆 2.Whichever is rejec

35、ted .,允收狀況(Accept Condition),可被剝除者D 10mil,可被剝除者D 10mil,不易被剝除者L 10mil,不易被剝除者L 10mil,理想狀況(Target Condition),拒收狀況(Reject Condition),允收狀況(Accept Condition),X0,X0,Y,YT,YT,X,1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。 1.The footprint of every lead be centered on the land,1.各接腳已發生偏滑，引線 腳的側面仍保留在焊墊 上(X0), 2.各接腳已發生偏滑，腳跟 剩餘焊墊的

36、寬度，最少保 有一個接腳厚度(YT)。 Footprint had shifted 1.Side face still on the land (X0) 2.The space from end of land to heel shall over the thickness of lead,1.各接腳己發生偏滑，引線腳 的側面已超出焊墊(X0)。 2.各接腳已發生偏滑，腳跟 剩餘焊墊的寬度，小於一個 接腳厚度(YT)。,SMT零件組裝工藝標準-功率晶體(Mosfet)零件之對準度 SMD Assembly workmanship criteria-Mosfet component align

37、ment,理想狀況(Target Condition),拒收狀況(Reject Condition),DIP零件組裝工藝標準-臥式零件組裝之方向與極性 DIP component Assembly workmanship criteria-Direction and polarity of horizontally , mounted,1.零件正確組裝於兩錫墊中央。 2.零件之文字印刷標示可辨識。 3.非極性零件文字印刷的辨識排 列方向統一。（由左至右，或 由上至下） 1.Component are centered between their lands 2.Component markin

38、gs are visible 3.Non-polarized components need to be oriented so that marking all read the same way (Left-to-right or top-to bottom),1.極性零件與多腳零件組裝正確。 2.組裝後,能辨識出零件之極性符號 3.所有零件按規格標準組裝於正確 位置。 4.非極性零件組裝位置正確，但文 字印刷的辨示排列方向未統一 (R1,R2)。 1.Polarized and multi-lead components are oriented correctly 2.Polariza

39、tion symbols are visible after assembly 3.All components are as specified and terminate to correct lands 4.Non-polarized components need not be oriented,1.使用錯誤零件規格(錯件)(MA)。 2.零件插錯孔(MA)。 3.極性零件組裝極性錯誤(MA)(極反) 4.多腳零件組裝錯誤位置(MA)。 5.零件缺組裝(MA)。(缺件) 6.Whichever is rejected。 1.Component is not as specified (

40、Wrong parts) 2.Component not mounted in correct holes 3.Polarized component mounted backwards (Wrong oriented) 4.Multilead component not oriented correctly 5.Component are missing(missing parts) 6.Whichever is rejected.,允收狀況(Accept Condition),+,R1,+ C1,Q1,R2,D2,+,R1,+ C1,Q1,R2,D2,+,C1 +,D2,R2,Q1,理想狀

41、況(Target Condition),拒收狀況(Reject Condition),DIP零件組裝工藝標準-立式零件組裝之方向與極性 DIP component Assembly workmanship criteria-Direction & polarity of vertically mounted,1.無極性零件之文字標示辨識 由上至下。 2.極性文字標示清晰。 1.The marking of non-polarized component can be identified . From top to down 2.Polarized marking be clearly,1.極

42、性零件組裝於正確位置。 2.可辨識出文字標示與極性。 1.Polarized component are mounted with correct oriental at right location 2.Marking and polarized symbol are identified cleatly,1.極性零件組裝極性錯誤 (MA)。(極反) 2.無法辨識零件文字標示 (MA)。 3.Whichever is rejected。,允收狀況(Accept Condition),1000F 6.3F,+,-,-,-,+,1000F 6.3F,+,+,+,-,-,-,+,10 16 +,

43、332J,1000F 6.3F,+,-,-,-,+,10 16 +, 332J,J233 ,理想狀況(Target Condition),拒收狀況(Reject Condition),DIP零件組裝工藝標準-零件腳長度標準 DIP component Assembly workmanship criteria-Length of component lead,1.插件之零件若於焊錫後有浮高 或傾斜,須符合零件腳長度標準。 2.零件腳長度以 L 計算方式 : 需從PCB沾錫面為衡量基準， 可目視零件腳出錫面為基準。 1.The protrusion length of component mee

44、t the spec even this parts tilted or floating 2.The protrusion length(L)be measured from land to tip of lead,1.不須剪腳之零件腳長度,目視 零件腳露出錫面。 2.須剪腳之零件腳長度下限標 準(Lmin)，為可目視零件腳 出錫面為基準。 3.一般零件腳最長長度(Lmax) 低於2.5mm。(L2.5mm) 4.特殊零件腳腳長規定： 4.1 Coil零件腳最長長度 (Lmax)低於3mm(L3mm) 4.2 XTAL/電容腳距2.5mm (含)以下之零件，腳最長長度(Lmax)低於2mm

45、(L2mm) 1.Non-trimed lead protrusion lead be identified on solder side 2.Lmin of trimed protrusion lead Minimum length is the protrusion lead profile be identified 3.Lmax2.5mm(for general components) 4.Special spwc of components: Coil Lmax3mm Xtal Lmax2mm(the clearance between two lead is less 2.5mm width),允收狀況(Accept Condition),Lmin :零件腳出錫面,Lmax Lmin,Lmax :L2.5 mm,Lmin :零件腳未出錫面,Lmax Lmin,Lmax :L2.5 mm(特