JEDEC工业标准7768.pdf

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1、JEDEC 工业标准 环境应力试验 JDa1 JESD22-A100-B Cycled Temperature-Humidity-Bias Life Test 上电温湿度循环寿命试验,(Revision of JESD22-A100-A)April 2000 Text-jd001 JDa2 JESD22-A101-B Steady State Temperature Humidity Bias Life Test 上电温湿度稳态寿命试验,(Revision of JESD22-A101-A)April 1997 Text-jd002 JDa3 JESD22-A102-C Accelerated

2、 Moisture Resistance-Unbiased Autoclave 高加速蒸煮试验,(Revision of JESD22-A102-B)December 2000 Text-jd003 JDa4 JESD22-A103-A Test Method A103-A High Temperature Storage Life 高温储存寿命试验,(Revision of Test Method A103 Previously Published in JESD22-B)July 1989 Text-jd004 JDa5 JESD22-A103-B High Temperature Sto

3、rage Life 高温储存寿命试验,(Revision of JESD22-A103-A)August 2001 Text-jd005 JDa6 JESD22-A104-B Temperature Cycling 温度循环,(Revision of JESD22-A104-A)July 2000(参见更新版本 A104C)Text-jd006 JDa7 EIA/JESD22-A105-B Test Method A105-B Power and Temperature Cycling 上电和温度循环,(Revision of Test Method A105-A)February 1996

4、Text-jd007 JDa8 JESD22-A106-A Test Method A106-A Thermal Shock 热冲击,(Revision of Test Method A106-Previously Published in JESD22-B)April 1995 Text-jd008 JDa9 JESD22-A107-A Salt Atmosphere 盐雾试验,(Revision of Test Method A107-Previously Published in JESD22-B)December 1989 Text-jd009 JDa10 JESD22-A108-B

5、Temperature,Bias,and Operating Life 高温环境条件下的工作寿命试验,(Revision of JESD22-A108-A)December 2000 JDa11 JESD22-A110-B Test Method A110-B Highly-Accelerated Temperature and Humidity Stress Test(HAST)高加速寿命试验,(Revision of Test Method A110-A)February 1999 Text-jd010 JDa12 JESD22-A113-B Preconditioning of Nonh

6、ermetic Surface Mount Devices Prior to Reliability Testing 非密封表贴器件在可靠性试验以前的预处理,(Revision of Test Method A113-A)March 1999 Text-jd011 JDa13 JESD22-A118 Accelerated Moisture Resistance-Unbiased HAST 不上电的高加速湿气渗透试验,December 2000 Text-jd012 JDa14 JESD22-B106-B Test Method B106-B Resistance to Soldering T

7、emperature for Through-Hole Mounted Devices 插接器件的抗焊接温度试验,(Revision of Test Method B106-A)February 1999 Text-jd013 JDa15 EIA/JESD47 Stress-Test-Driven Qualification of Integrated Circuits 集成电路施加应力的产品验收试验,July 1995 Text-jd031 JDa1 JESD22-A104C Temperature Cycling,(Revision of JESD22-A104-B)May 2005 Te

8、xt-jd040 电应力和电测试试验 JDb1 JESD22-A114-B Electrostatic Discharge(ESD)Sensitivity Testing Human Body Model(HBM)人体模型条件下的静电放电敏感度试验,(Revision of JESD22-A114-A)June 2000 Text-jd014 JDb2 EIA/JESD22-A115-A Electrostatic Discharge(ESD)Sensitivity Testing Machine Model(MM)机器模型条件下的静电放电敏感度试验,(Revision of EIA/JESD

9、22-A115)October 1997 Text-jd015 JDb3 JESD22-A117 Electrically Erasable Programmable ROM(EEPROM)Program/Erase Endurance and Data Retention Test EEPROM 的擦涂和数据保存试验,January 2000 Text-jd016 JDb4 EIA/JESD78 IC Latch-Up Test 集成电路器件闩锁试验,March 1997 Text-jd017 JDb5 JESD22-C101-A Field-Induced Charged-Device M

10、odel Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components 微电子器件在电荷感应模型条件下的抗静电放电试验,(Revision of JESD22-C101)June 2000 Text-jd018 机械应力试验 JDc1 JESD-22-B103-A Test Method B103-A Vibration,Variable Frequency 振动和扫频试验(Revision of Test Method B103 Previously Published i

11、n JESD22-B)July 1989 Text-jd019 JDc2 JESD22-B104-A Test Method B104-A Mechanical Shock 机械冲击(Revision of Test Method B104,Previously Published in JEDEC Standard September 1990 Text-jd020 JDc3 EIA/JESD22-B116 Wire Bond Shear Test Method 焊线邦定的剪切试验方法,July 1998 Text-jd021 JDc4 JESD22-B117 BGA Ball Shear

12、BGA 焊球的剪切试验,July 2000 Text-jd022 JDc5 JESD22B113 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products,March 2006 Text-jd038 JDc6 JESD22-B111 Board Level Drop Test Method of Components for Handheld Electronic Products,July 20

13、03 Text-jd039 综合试验与测试 JDd1 JEDEC Standard Test Method A109 Hermeticity 密封性试验,July 1988 Text-jd023 JDd2 JESD22-A120 Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Integrated Circuits 集成电路器件中使用的有机材料水分扩散和水溶性测定试验方法,June 2001 Text-jd024 JDd3 JESD

14、22-B100-A Physical Dimensions 物理尺寸的测量,(Revision of Test Method B100-Previously Published in JESD22-B)April 1990 Text-jd025 JDd4 JESD22-B101 Test Method B101 External Visual 外观检查,(Previously published in JESD22-B)September 1987 Text-jd026 JDd5 EIA/JESD22-B102-C Solderability Test Method 可焊性试验方法,Septe

15、mber 1998 Text-jd027 JDd6 EIA/JESD22-B105-B Test Method B105-B Lead Integrity 器件管脚的完整性试验,(Revision of Test Method B105-A)January 1999 Text-jd028 JDd7 EIA/JESD22-B107-A Test Method B107-A Marking Permanency 图标的耐久性试验,(Revision of Test Method B107-Previously Published in JESD22-B)September 1995 Text-jd

16、029 JDd8 JESD22-B108 Coplanarity Test for Surface-Mount Semiconductor Devices 表贴半导体器件的共面性试验,November 1991 Text-jd030 其它 JDe1 JEP113-B Symbol and Labels for Moisture-Sensitive Devices 湿度敏感器件的符号和标识,(Revision of JEP113-A)May 1999 Text-jd032 JDe2 EIA/JEP122 Failure Mechanisms and Models for Silicon Semi

17、conductors Devices 硅半导体器件的失效机理和模型,February 1996 Text-jd033 JDe3 IPC/JEDEC J-STD-020A Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别,April 1999 Text-jd034 JDe4 IPC/JEDEC J-STD-033 Standard for Handling,Packing,Shipping and Use

18、of Moisture/Reflow Sensitive Surface Mount Devices 湿度/回流焊敏感标贴器件的处理、包装、运输和使用的标准,May 1999 Text-jd035 JDe5 EIA/JEP103-A Suggested Product-Documentation Classifications and Disclaimers,(Revision of JEP103)July 1996 Text-jd036 JDe6 IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别,Supersedes IPC/JEDEC J-STD-020D August 2007,March 2008 Text-jd037