芯片制造介绍.pptx

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1、第1页/共17页Tomakewafers,polycrystallinesiliconismelted.Themeltedsiliconisusedtogrowsiliconcrystals(oringots)thatareslicedintowafers.首先融化多晶硅，生成晶柱，然后切割成晶圆。RawMaterialforWafers晶圆制作所需原料第2页/共17页Toremovethetiniestscratchesandimpurities,onesideofeachwaferispolishedtoamirror-likesurface.Chipsarebuiltonthissurf

2、ace.切下的晶圆要经过清洁、磨光等步骤以去除杂质，使平面光滑。RawMaterialforWafers(Contd)晶圆制作所需原料(接上页)第3页/共17页Alayerofsilicondioxide(SiO2)glassisgrownonthewaferbyexposingthewafertooxygenatveryhightemperatures.Aprocesscalledchemicalvapordeposition(CVD)isthenusedtocoatsilicondioxideontothewafersurface.Becauseitwillnotconductelectr

3、icity,thislayeriscalled“dielectric”.Later,channelswillbeetchedorotherwiseformedinthedielectricforconductingmaterials.SiO2mayalsobegrownordepositedduringlaterstepsintheprocessaslayersofthecircuitarebuiltontothechips:制作晶片的第一步是在晶圆上沉积一层不导电的二氧化硅。在晶片的后续制作过程中，二氧化硅层的成长、沉积会进行很多次。在高温下使晶圆曝氧可以使二氧化硅层成长。然后使用化学气相沉

4、积方法使二氧化硅层沉积在晶圆表面。ChipManufacturingProcessDeposition芯片制作过程沉积SMIC第4页/共17页What is microlithography?Microlithography:transfer the pattern of circuitry from a mask to a wafer.第5页/共17页Photolithography,orlithographyforshort,isusedtocreatemultiplelayersofcircuitpatternsonachip.First,thewaferiscoatedwithalig

5、ht-sensitivechemicalcalledphotoresist.Thenlightisshonethroughapatternedplatecalledamaskorreticletoexposetheresistmuchthesamewayfilmisexposedtolighttoformaphotographicimage.下面使用光刻制程在芯片建立多层电路图案。首先，晶圆表面上覆盖上一层感光性强的化学制品光刻胶。象光透过电影底片形成图象一样，光透过光掩膜在晶圆上形成图案。ChipManufacturingProcessPhotolithography芯片制作过程光刻SMIC

6、第6页/共17页Thewafersexposuretolightinlithographycausesportionsoftheresistto“harden”(orbecomeresistanttocertainchemicals).The“non-hardened”resistiswashedaway.Thenthematerialbelowit,forexampleSiO2,isetchedaway.Finally,the“hardened”resistisstrippedoffsothatthematerialunderneathformsathree-dimensionalpatte

7、rnonthewafer.ThefirstlithographyandetchprocesswillresultinapatternofSiO2.光刻制程后，感光部分的光刻胶具有强的抗腐蚀性，抗腐蚀性弱的光刻胶在接下来的制程里被洗去。接着光刻胶下面的部分被蚀刻制程除去。最后，抗腐蚀性强的光刻胶也被剥离。光刻与蚀刻制程在晶圆表面形成3D的图案。ChipManufacturingProcessEtching芯片制作过程蚀刻SMIC第7页/共17页Throughseverallithographyandetchsteps,subsequentlayersofvariouspatternedmater

8、ialsarebuiltuponthewafertoformmultiplelayersofcircuitpatternsonasinglechip.经过几次光刻与蚀刻步骤，在晶圆表面叠加成多层不同图案ChipManufacturingProcessFormingMultipleLayers芯片制作过程生成多层SMIC第8页/共17页Tocontroltheflowofelectricitythroughachip,certainareasofthewaferareexposedtochemicalsthatchangeitsabilitytoconductelectricity.Atomsf

9、romthechemicals,calleddopingmaterials,canbe“diffused,”orforced,intoareasofthesiliconwaferthroughchemicalexposureandheating.为了能在晶片上控制电流，加热晶圆，使晶圆部分区域接触添加剂。添加剂里的原子能够替换晶圆里的部分硅原子来改变其导电性。ChipManufacturingProcessIonImplantation芯片制作过程离子植入SMIC第9页/共17页Theportionsofachipthatconductelectricityformthechipsinterc

10、onnections.Aconductingmetal(usuallyaformofaluminum)isdepositedontheentirewafersurface.Unwantedmetalremovedduringlithographyandetchingleavesmicroscopicallythinlinesofmetalinterconnects.Allthemillionsofindividualconductivepathwaysmustbeconnectedinorderforthechiptofunction.Thisincludesverticalinterconn

11、ectionsbetweenthelayersaswellashorizontalInterconnectionsacrosseachlayerofthechip.进行电连接。导电金属（通常是铝）在晶圆表面沉积。使用光刻和蚀刻制程去除没有用的金属。现在复杂的晶片都需要很多层绝缘体。一个正常运作的晶片需要连接数以百万计的传导线路，包括层上水平连接和各层之间的垂直连接。ChipManufacturingProcessElectroplating芯片制作过程电路连接SMIC第10页/共17页SMIC0.13uCuBEOLFlowSMIC0.13uCuBEOLFlowSMIC is currently

12、 running 1P6M,1P8M process第11页/共17页Eachchiponacompletedwaferistestedforelectricalperformance.Anychipsthatfailaremarkedsotheycanbediscardedwhensawedintoindividualdies.Thechipsareputintoindividualpackageswhichwillprotectthechipsandprovideconnectionsfromthechipstotheproductsforwhichtheyaredesigned.Fore

13、xample,chipsdestinedforcomputersareplacedInpackagingthatcanbepluggedintocomputercircuitboards.Oncepackaged,chipsaretestedagaintomakesuretheyfunctionproperlybeforebeingshippedtodistributorsorplacedinelectronicproducts.晶圆上的每一个晶粒都需要进行测试。有缺陷的晶粒被标记起来，在进行晶圆切割时这些晶粒被剔除。每个晶粒都按要实现功能的不同进行单独封装。比如要应用在电脑上的晶粒被封装后能

14、够插入电脑集成电路板。封装好后，在进行最终使用前，晶粒将进行再一次测试以确保功能正常。ChipManufacturingProcessAssembly&Testing芯片制作过程切割、封装SMIC第12页/共17页Package Types and Applications(1)Conventional Leadframe Type(PDIP,SOP,TSOP,QFP)Advanced Substrate Type(BGA)Molding compoundLeadframeGold wireDieEpoxy(Silver paste)Die attach padMolding compound

15、Epoxy(Silver paste)DieGold wireSolder ballBT resinThrough holeDieGold wireLOC tapeLeadframe with Down-setLOC(Lead-on-chip)Introduction of the Semiconductor Packages and Introduction of the Semiconductor Packages and AssemblyAssembly第13页/共17页晶柱Silicon Ingot晶圆Wafer离子植入切割、封装电镀(Die,晶粒)(Chip,晶芯)蚀刻沉积Ion ImplantationAssembly&TestingElectroplatingEtchingDeposition SMIC Business应用领域Applications应用领域光罩制作/光刻Mask Making/Photolithography中芯业务ChipManufacturingProcessSummary芯片制作过程总结第14页/共17页Thanks 谢谢谢谢Q&A 请您提问请您提问第15页/共17页第16页/共17页感谢您的观看！第17页/共17页