1-2SMT三大工序简介.ppt

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1、SMT三大工序簡介三大工序簡介2021/9/171目目錄錄一、錫膏印刷機二、高速貼片機三、FEEDER的認識四、泛用機五、回焊爐2021/9/172一一、錫膏印刷機、錫膏印刷機1.1 SMT三大關鍵工序1.2 錫膏印刷機（UP2000）2021/9/1731.1SMTSMT三大關鍵工序三大關鍵工序印刷印刷貼片貼片回流焊回流焊2021/9/1741.2錫膏印刷錫膏印刷(UP2000)相關制程條件:-印刷參數-錫膏/固定膠-鋼板設計-刮刀-PCB設計-自動鋼板清洁-全視覺識別系統2021/9/175Laser cut and electropolished stencilMetal squeege

2、eLength:14”&16”Solder paste2021/9/176定位治具PCBCAMERA2021/9/177印刷之OK產品2021/9/178二、高速貼片機二、高速貼片機(MSH3)(MSH3)-反射識別系統 -16個旋轉工作頭帶2種Nozzle-最快貼片速度:0.075 Sec/Comp,48000comps/hour-貼片零件種類:1005mm Chip18*18mmQFP,6.5mmHeight.2021/9/179Head unitPCB camera2021/9/1710高速机料站排列高速机料站排列Feeder2021/9/1711三、供料器識別三、供料器識別3.1 供料

3、器識別3.2 料帶識別2021/9/17123.13.1供料器供料器(FEEDER)(FEEDER)識別識別8*4膠帶FEEDER 8*4紙帶FEEDER16*12膠帶FEEDER16*8膠帶FEEDER2021/9/17133.2 3.2 FEEDER&料帶識別料帶識別泛用機FEEDER 泛用機FEEDER型號標示紙 帶 料膠 帶 料2021/9/1714何謂W*4P PAPER8W指該可容納料帶寬度為mmP指每推動一下前進mmPAPER指該Feeder為紙帶Feeder2021/9/1715高速貼片機(MV2VB)相關制程條件:-貼片參數-Program-Feeder&Nozzle-來料-

4、反射及透射識別系統-12個旋轉工作頭,5種Nozzle-最快貼片速度:0.1 Sec/Comp-貼片零件種類:0402mm Chip32*32mmQFP6.5mmHeight.2021/9/1716PCB CameraRotaryHead unitParts recg.camera2021/9/1717四、泛用機四、泛用機(MPAV2B)(MPAV2B)-4 個工作頭,自動換Nozzle-Tape Feeder&Tray 供料方式-2D&3D識別系統-最快貼片速度:0.53 Sec/QFP,0.44Sec/chip2021/9/1718Head unitParts recg.camera-貼片

5、零件種類:1005mm Chip55*55mm QFP L150*W55*H25,BGA,CSP2021/9/1719貼片OK之產品2021/9/1720 回焊爐回焊爐(Heller 1800exl)相關制程條件:-Temp profile-錫膏/固定膠品質-來料品質-全熱風對流-鏈條+鏈网偉送-自動鏈條潤滑2021/9/1721五、回焊爐五、回焊爐(Heller 1800exl)(Heller 1800exl)SP:設定溫度PV:實際溫度BELT:傳送速度2021/9/1722錫膏溫度曲線錫膏溫度曲線2021/9/1723SMT Reflow Soldering Profile for so

6、lder paste(1)Keep the slope low to minimize motherboard warping during preheat and cool down.Peak temp215+/-10deg CSlope 3degC/secTime above liquidus 45-90 secondsSlope-2-5degC/secHold at 140-183 deg C for 6090Seconds183 CBoard Temp(預熱區)(恆溫區)(回焊區)(冷卻區)Time 130-160C range:Extended period allows board temperature to stabilize(warp)and allows flux to finish cleaning prior to reflow.Also help minimize thermal of reflow.Slope 2degC/secPreheatSoakReflow2021/9/1724