各种表面处理的无铅焊接润湿性测试PCB finish wetting balance test.ppt

《各种表面处理的无铅焊接润湿性测试PCB finish wetting balance test.ppt》由会员分享，可在线阅读，更多相关《各种表面处理的无铅焊接润湿性测试PCB finish wetting balance test.ppt（35页珍藏版）》请在得力文库 - 分享文档赚钱的网站上搜索。

1、Wettability testing of copper based surface finishes for lead free assembly/各表面處理的無鉛焊接焊錫性測試Information provide by Atotech/資料由Atotech提供2006.3.2Training principle/培訓原則nNo advertisement/拒絕做廣告nFocus on experimental methodology and conclusions/注重于實驗方法和結論nWith the aim of learning and self-improvement/本著學習

2、和自我提升的思想nOn the basis of discussion and communication/立足于交流與討論PT manager claims/生技經理宣A few notes/几點說明nThis is a genuine piracy/本報告純屬盜版nFeel free to ask/有問題盡管問nPrepare for my questions/請准備解答我的問題nCorrect any existing mistake/糾正所有存在的錯誤nThe accuracy of the data is reserved/本人不負責數据的准确性Jeek claims/袁進 宣Con

3、tent/內容lGeneral introduction/簡介lReflow profiles/回流焊溫度曲線lWettability testing&methods/潤濕性測試與方法lDiscussion/討論lConclusion/結論Whats different in lead free soldering?/無鉛焊接到底不同在哪里?lPeak temperature is higher/最高焊接溫度更高了lTime above liquidus is longer/焊料在熔化狀態下的時間更長了lSolder composition is different/焊料的成份有變化What

4、does it mean?/無鉛焊接意味著什么?lHigher temperature/longer times/different solder alloy/更高的焊接溫度/更長的熔錫時間/焊料合金成份的變化Stronger oxidation of solder paste and surface finish/焊膏和表面處理的氧化更嚴重Thickness of IMC increased/合金層厚度更厚Metallurgy of solder joints is different/焊接點金屬特性的變化lNo long term production experience/沒有長期的量產

5、經驗Reflow equipment/回流焊設備l Reflow equipment for investigations/用于研究的回流焊設備REHM Nitro 2100l N2 atmosphere with controlled O2 concentration/氮氣保護,控制氧气含量l5 heating zones/個加熱段lConvection reflow system/對流傳熱回流焊系統Used reflow profile for subsequent aging and soldering/后續的老化實驗和焊接的溫度曲線lEutectic tin lead/錫鉛合金lSn/

6、Pb/錫鉛比 63/37/lLead free/無鉛焊料lSnAgCu/錫銀銅比307Peak最高溫度210/46s秒183oCPeak 最高溫度260/60s秒217oCAll profiles same duration of time各种溫度曲線所經歷的時間Copper based final finishes,investigated layers 研究的各种表面處理層Surface finish/表面處理Specification/規格Immersion tin/化學錫1.2um,incl.anti-whisker additive/1.2um厚,含防錫鬚添加劑Immersion s

7、ilver/化學銀0.2um,commercially available silver/organic/0.2um厚,市面上的含有机保護膜的產品HASL/熱風整平(噴錫)SnCuNi,horizontally processed/水平線OSP/有机保護膜Lead free compatible/無鉛焊接型Wettability testing/潤濕性測試lComparison of/對比性測試項目Wetting balance/潤濕平衡性測試Solder spread/錫料延伸性測試Mis-print test/絲印錯位測試De-wetting/縮錫測試lVarying/可變因素Solder

8、 flux/不同的助焊劑Solder alloys/eutectic tin-lead vs.lead-free/不同的焊料錫鉛焊料與無鉛焊料Soldering atmosphere/air vs.N2/在空气中焊接與在氮氣保護下焊接Wetting balance潤濕平衡測試/Metronelec ST60(設備名稱)lOperator independent test method/采用無人員差异性的方法lEspecially design coupon/特別設計的couponl10 coupons per surface/test每面或測測試10 個couponlThe tested sa

9、mples are fluxed before immersed into the solder pot/測試樣本在浸錫前需上助焊劑lResults are given for wetting force and wetting time/設備用于潤濕力測試和潤濕時間測試lSequence/mechanism similar to wave soldering/模擬波峰焊的步驟和机理Wetting balance-tested solder fluxes/潤濕平衡測試-測試用的助焊劑种類lUsing solder pot with SnAg3.5Cu0.7 alloy/錫爐采用SnAg3.5C

10、u0.7的合金l260oClAir atmosphere/空气中測試Tested fluxes/測試用的助焊劑种類Activity level of flux/Flux residue 助焊劑种類Presence of halide/是否含鹵素IPC-flux*acc.to J-STD-003ALow低Yes是Stannol 500-6 BModerate中等No否Litton Kester 950E3Low低No否Wetting balance test-Wetting force/潤濕平衡測試潤濕力測試lSnAg3.5Cu0.7 alloy at 260oC/air atmospherel

11、條件:空气作業,錫銀銅合金,260oClTested fluxes had minor impact to wetting forcel結論:各种助焊劑對潤濕力影響不大Initial test to determine solder flux for subsequent testing/本實驗為初步實驗,主要用于為后續試驗選取助焊劑No wetting force using the litton kester flux/使用litton kester 沒用潤濕力Wetting balance test-Wetting time/潤濕平衡測試潤濕時間測試lChoice of solderin

12、g flux strongly impacts wetting timel結論:助焊劑的選擇對潤濕時間的影響很大Initial test to determine solder flux for subsequent testing/本實驗為初步實驗,主要用于為后續試驗選取助焊劑lSnAg3.5Cu0.7 alloy at 260oC/air atmospherel條件:空气作業,錫銀銅合金,260oCNo wetting force using the litton kester flux/使用litton kester 沒用潤濕力Wetting balance test-Wetting t

13、ime/潤濕平衡測試潤濕時間測試lNitrogen atmosphere during aging/soldering improves wetting timel結論:在老化實驗和焊接時使用氮氣保護能夠改善潤濕時間After reflow ageing/reflow老化實驗后Immersion tin Tin lead vs.lead free solder alloy化學錫表面處理 錫鉛焊接與無鉛焊接的對比Wetting balance test-Wetting time/潤濕平衡測試潤濕時間測試Litton Kester 950 E3 助焊劑助焊劑lLead free using N2

14、atmosphere shows equivalent wetting time to eutecticl結論:使用氮氣保護的無鉛焊接與錫鉛焊接的潤濕時間相當Wetting balance test/潤濕平衡測試 (小結篇)lTested“moderate”activated flux showed no improvement/中等活性的助焊劑沒有改善作用lTested“halogen”containing flux only improves for OSP/助焊劑是否含鹵素只對OSP表面處理有影響lNitrogen atmosphere improved wetting time for

15、 all finishes/氮氣保護對所有表面處理的潤濕時間都有貢獻lImmersion tin showed comparable wetting time for lead free in combination with nitrogen atmosphere to eutectic tin lead/對于化學錫表面處理來說,在氮氣保護下的無鉛焊接與在空气環境中的錫鉛焊接潤濕時間相當Impact of flux,alloy and atmosphere on Metronelec test/助焊劑,焊料成份和是否有氮氣保護的影響(在Metronelec上測試)Wettability te

16、sting/潤濕性測試lSolder alloys pastes(錫膏)Tin/lead(錫鉛)Senju OZ AT-221CM-42-10(peak最高焊接溫度 210oC)/NC-SMQ 92H(peak最高焊接溫度 210oC)Lead-free(無鉛)KOKI S3X58-M406(Sn/Ag3.0/Cu0.5)(最高焊接溫度 peak 260oC)/Indium5.8 LS(Sn/Ag3.0/Cu0.5)(最高焊接溫度 peak 260oC)lAtmosphere(實驗環境)Air/空气中N2/氮氣保護Solder spread(錫料延伸性測試)/mis print(絲印錯位實驗)

17、/de-wetting(縮錫實驗)Wettability testing/潤濕性測試lSolder paste printing on a solderable surface/將錫膏印在可焊表面lThe spread of liquefied and solidified solder is measure/量測熔化擴張凝固后的焊料尺寸lSolder spreads in all directions(360o)only on the pad surface(2 dimensional)/焊料在pad表面二維的向各個方向擴張lSequence/mechanism similar to sta

18、ndard SMT reflow soldering/程序机理模擬標准的SMT回流焊Solder spread(錫料延伸性測試)40 solder dots per surface/test 每表面/測試40個焊點lOnly the bulk soldered diameter was measured,not the solder spikes/量測時只量測大塊的熔錫而不算單點的錫突點Wettability testing/潤濕性測試Solder spread(錫料延伸性測試)Immersion tin/化學錫Immersion silver/化學銀OSP/有机保護膜Wettability

19、testing/Solder spread 潤濕性測試/錫料延伸性測試lHASL was the only finish that exhibited a decrease in area after ageing/只有噴錫表面處理在老化實驗后出現縮錫現象lSlight improvement using N2 atmosphere during ageing and reflow soldering/在老化實驗和焊錫時使用空气保護只有微小的改善作用Comparison of atmosphere during ageing and soldering/對比老化和焊接時空气保護的作用Wetta

20、bility testing/Solder spread 潤濕性測試/錫料延伸性測試lNitrogen atmosphere during lead free reflow ageing could not achieve same wetted area as eutectic tin lead/競管在老化和焊接時應用氮氣保護無鉛焊接荏苒無法達到錫鉛焊接的潤濕面積Immersion tin Tin lead vs.lead free solder alloy/化學錫表面處理錫鉛焊接與無鉛焊接的對比Wettability testing/Solder spread 潤濕性測試/錫料延伸性測試(

21、小結篇)lHASL was the only finish that showed a decrease in area after ageing/只有噴錫表面處理在老化實驗后出現縮錫現象lSlight improvement using N2 atmosphere during ageing and reflow soldering/在老化實驗和回流焊時使用氮氣保護只有微小的改善作用lImmersion tin-nitrogen atmosphere during lead free reflow ageing could not achieve same wetted areas as e

22、utectic tin lead/化學錫表面處理 在無鉛焊接老化試驗時使用氮氣保護荏苒無法達到錫鉛焊接的潤濕面積Impact of paste,alloy and atmosphere on solder spread test/錫膏合金成份和是否有氮氣保護對錫料延展性測試的影響Wettability testing/Mis print test 潤濕性測試/絲网錯位測試lSolder paste printed on a solderable surface/將焊膏印在可焊接的表面lThe spread of liquefied and solidified solder is measur

23、ed/量測熔化擴張凝固后的焊料尺寸lSolder spreads in only one direction surrounding 3 sides of the NSMD OFP surface(3dimensional)/焊料的擴張只有一個方向,同時又是包圍OFP的三個面的(此是三維的)lSequence/mechanism similar to SMD reflow soldering,but paste printing simulates an accident in pasting printing/程序和机理模擬SMD回流焊,但是焊料印刷故意印偏40 QFP pads per s

24、urface/test 每面/測試 40個 QFP padWettability testing/Mis print test 潤濕性測試/絲网錯位測試lN2 atmosphere improves coverage and minimize discolorationl結論:氮氣保護增加了焊料的覆蓋率,同時對變色也有貢獻Comparison of atmosphere during ageing and soldering/對比老化和焊接時是否有氮氣保護的影響Wettability testing/Mis print test 潤濕性測試/絲网錯位測試lN2 atmosphere shows

25、 equivalent coverage to eutecticl結論:在無鉛焊接時,使用氮氣保護可以達到錫鉛焊接類似的覆蓋率Immersion Tin Tin lead vs.lead free solder alloy 化學錫表面處理 錫鉛焊料與無鉛焊料的對比Wettability testing/Mis print test 潤濕性測試/絲网錯位測試(小結篇)lAll surface showed an improvement using nitrogen atmosphere/氮氣保護對任何一种表面處理都有貢獻lTest results are in contradiction to

26、solder spread testing(same surface finish,paste and atmosphere)/絲印錯位實驗的結果與錫料延展性測試的結果并不一致性(相同的表面處理,焊料以及實驗環境)lThe HASL surface was the only finish that showed a strong yellow during ageing in air atmosphere/只有噴錫表面處理在空气中進行老化實驗時表面會有發黃現象lImmersion tin equivalent test results are achieved compared to eute

27、ctic tin lead testing/化學錫的表面處理在氮氣保護下的無鉛焊接可以達到在空气中錫鉛焊接的效果Impact of paste,alloy and atmosphere on Mis print test/錫膏合金成份和是否有氮氣保護對絲印錯位測試的影響Wettability testing/De-wetting 潤濕性測試/縮錫實驗lSolder paste printing on a solderable surface/將焊料印在可焊接的表面lIs impacted by surface tension of solder paste and alloy to wetti

28、ng force/焊料同時受到自身的表面張力和潤濕力的作用lDe-wetting starts in corners,as surface tension wetting force/當表面張力大于潤濕力的時,縮錫現象首先出現在拐角處lSequence/mechanism similar to SMD reflow soldering on large pads/流程和機理類似大pad的SMD回流焊10 pads per surface/test/每表面或測試有10個 pads With total 40 squared solder depots 一共40個方形焊點De-wetting st

29、art points/縮錫開始點Wettability testing/De-wetting 潤濕性測試/縮錫實驗lNo de-wetting for immersion tin/化學錫沒有縮錫問題lN2 improved de-wetting occurrence for the other finishes/對于其它表面處理來說氮氣保護降低了縮錫的几率Comparison of atmosphere during ageing and soldering/對比老化和焊接時是否有氮氣保護的影響Wettability testing/De-wetting 潤濕性測試/縮錫實驗lNo de-we

30、tting for immersion tin/化學錫沒有縮錫問題lChanging solder paste did not improve de-wetting occurrence for I-Ag/對化學銀來說改變焊膏並不能降低縮錫的發生几率I-Sn/I-Ag comparison of solder alloys/paste/atmosphere 化學錫化學銀表面處理對比不同的焊料組成,焊膏,焊接環境的影響Wettability testing/De-wetting 潤濕性測試/縮錫實驗(小結篇)lExcept immersion tin,all surface finishes e

31、xhibit strong de-wetting using air atmosphere(immersion silver layer showed de-wetting for the eutectic tin lead and both lead free soldering paste)/除了化學錫所有的表面處理在空气中都有縮錫現象(其中化學銀無論是使用錫鉛焊料還是無鉛焊料都有縮錫問題)lAll surface showed a noticeable improvement using nitrogen atmosphere/使用氮氣保護對所有表面處理都有貢獻lDiscoloratio

32、n was minimized using nitrogen atmosphere/使用氮氣保護降低了表面變色問題Impact of paste,alloy and atmosphere on De-wetting test/錫膏合金成份和是否有氮氣保護對縮錫測試的影響Wettability testing conclusion I潤濕性測試結論一lWetting balance/潤錫平衡測試Wetting times are strongly depending on flux/各种助焊劑對潤濕時間影響很大Comparable wetting time by using N2 atmosph

33、ere/使用氮氣保護的無鉛焊接潤濕時間與錫鉛焊接的潤濕時間相當lSolder spread錫料的延伸性Tested paste shows a strong decrease in wetted area/測試的錫膏潤濕面積明顯減小lMis print/絲印錯位試驗Comparable results by using N2 atmosphere/使用N2保護何以得到很好的結果Minimized flow of solder paste after reflow ageing in air/在空气中老化實驗后焊膏的流動減小Tested pastes shows a strong decreas

34、e in wetted area/測試的錫膏潤濕面積明顯減小lDe-wetting/縮錫實驗Great improvement by using N2 atmosphere/使用氮氣保護有明顯的改善效果Wettability testing conclusion II潤濕性測試結論二lFor the investigated copper based finishes/對于研究的各种表面處理Relative different results is obtained for the different tests/不同的實驗可能得到不同的結果Factors such as flux syste

35、m further complicate the interpretation of the data/助焊劑等体系因數的影響使得試驗結果不容易解釋lEach tested surface finish had at least one test“in favor”where it was less affected by reflow ageing/每種表面處理至少有一個實驗表明它受老化實驗影響最小Therefore an overall comparison is a difficulty task/因此全面的比較相當困難Individual test should be chosen i

36、n cooperation with assembly/不同表面處理的焊接因該選擇不同的實驗lNone of the finish consistently outperform the others/沒有一种絕對优越的表面處理There was always a drawback in one of the tests/每種測試都有它的局限性lNitrogen atmosphere had a beneficial impact to gained wettability data/從潤濕性實驗的數据來看,氮氣保護是有利的Eliminated any doubts of de-wetting

37、 tendency(for tested layers/pastes/atmospheres/alloys)/消除了對縮錫趨勢的怀疑(對于測試的表面處理,焊膏,環境,以及合金組成來說)Wettability testing-潤濕性測試lEach test is unique with its approach/每種測試的方法都是獨特的lEach test will focus on individual mechanism to determine the suitability for subsequent assembly/不同的實驗關注于不同的机理以判斷是否适用于后續的組裝lJoint effort within the industry needs to take place to clarify pass/fail criterias for the new regime of lead free wettability testing/業界應該聯合制定無鉛潤濕性的允收標准.Discussion/討論The endThank you for your time!