SMT 湿敏元件烘烤 标准.pdf

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1、JOINTINDUSTRYSTANDARDHandling,Packing,Shipping and Use ofMoisture/ReflowSensitive SurfaceMount DevicesIPC/JEDEC J-STD-033B.1Includes Amendment 1January 2007Supersedes IPC/JEDEC J-STD-033BOctober 2005Copyright Association Connecting Electronics Industries Provided by IHS under license with IPCLicense

2、e=Sanmina SCI Corp San Jose/5964569001 Not for Resale,09/26/2007 07:00:25 MDTNo reproduction or networking permitted without license from IHS-,-,-NoticeJEDEC and IPC Standards and Publications are designed to serve the publicinterest through eliminating misunderstandings between manufacturers andpur

3、chasers,facilitating interchangeability and improvement of products,and assisting the purchaser in selecting and obtaining with minimum delaythe proper product for his particular need.Existence of such Standards andPublications shall not in any respect preclude any member or nonmemberof JEDEC or IPC

4、 from manufacturing or selling products not conformingto such Standards and Publications,nor shall the existence of such Standardsand Publications preclude their voluntary use by those other than JEDECand IPC members,whether the standard is to be used either domesticallyor internationally.Recommende

5、d Standards and Publications are adopted by JEDEC andIPC without regard to whether their adoption may involve patents on articles,materials,or processes.By such action,JEDEC and IPC do not assume anyliability to any patent owner,nor do they assume any obligation whateverto parties adopting the Recom

6、mended Standard or Publication.Users are alsowholly responsible for protecting themselves against all claims of liabilitiesfor patent infringement.The material in this joint standard was developed by the JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the IPCPlastic Chip

7、Carrier Cracking Task Group(B-10a)For Technical Information Contact:JEDEC Solid StateTechnology Association2500 Wilson BoulevardArlington,VA 22201Phone(703)907-7500Fax(703)907-7583IPC3000 Lakeside DriveSuite 309SBannockburn,Illinois60015-1249Tel(847)615-7100Fax(847)615-7105Please use the Standard Im

8、provement Form shown at the end of thisdocument.Copyright 2007.JEDEC Solid State Technology Association,Arlington,Virginia,and IPC,Bannockburn,Illinois.All rights reserved underboth international and Pan-American copyright conventions.Any copying,scanning or other reproduction of these materials wit

9、hout the priorwritten consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.Copyright Association Connecting Electronics Industries Provided by IHS under license with IPCLicensee=Sanmina SCI Corp San Jose/5964569001 Not for R

10、esale,09/26/2007 07:00:25 MDTNo reproduction or networking permitted without license from IHS-,-,-IPC/JEDEC J-STD-033B.1Includes Amendment 1Handling,Packing,Shipping and Use ofMoisture/ReflowSensitive SurfaceMount DevicesA joint standard developed by the JEDEC JC-14.1 Committee onReliability Test Me

11、thods for Packaged Devices and the B-10a PlasticChip Carrier Cracking Task Group of IPCUsers of this standard are encouraged to participate in thedevelopment of future revisions.Contact:JEDEC2500 Wilson BoulevardArlington,VA 22201Phone(703)907-7500Fax(703)907-7583IPC3000 Lakeside Drive,Suite 309SBan

12、nockburn,Illinois60015-1249Tel(847)615-7100Fax(847)615-7105Supersedes:IPC/JEDEC J-STD-033B-October 2005IPC/JEDEC J-STD-033A-July 2002IPC/JEDEC J-STD-033-April 1999JEDEC JEP124IPC-SM-786A-January 1995IPC-SM-786-December 1990ASSOCIATION CONNECTINGELECTRONICS INDUSTRIESCopyright Association Connecting

13、Electronics Industries Provided by IHS under license with IPCLicensee=Sanmina SCI Corp San Jose/5964569001 Not for Resale,09/26/2007 07:00:25 MDTNo reproduction or networking permitted without license from IHS-,-,-This Page Intentionally Left BlankCopyright Association Connecting Electronics Industr

14、ies Provided by IHS under license with IPCLicensee=Sanmina SCI Corp San Jose/5964569001 Not for Resale,09/26/2007 07:00:25 MDTNo reproduction or networking permitted without license from IHS-,-,-AcknowledgmentMembers of the Joint IPC/JEDEC Moisture Classification Task Group have worked to develop th

15、is document.We wouldlike to thank them for their dedication to this effort.Any Standard involving a complex technology draws material from avast number of sources.While the principal members of the Joint Moisture Classification Working Group are shown below,it is not possible to include all of those

16、 who assisted in the evolution of this Standard.To each of them,the members of theJEDEC and IPC extend their gratitude.IPC Plastic Chip CarrierCracking Task Group,B-10aChairmanSteven MartellSonoscan,Inc.JEDEC JC 14.1CommitteeChairmanJack McCullenIntel CorporationJEDEC JC 14ChairmanNick LycoudesFrees

17、cale SemiconductorJoint Working Group MembersJasbir Bath,Solectron CorporationJames Mark Bird,Amkor TechnologyInc.Michael W.Blazier,Delphi DelcoElectronicMaurice Brodeur,Analog DevicesInc.Peter Brooks,Amkor TechnologyRalph Carbone,Hewlett Packard Co.Henry Charest,Allegro MicroSystemsInc.Jeffrey C.Co

18、lish,Northrop GrummanCorporationAndrew Corriveau,CogiscanJ.Gordon Davy,Northrop GrummanCorporationWerner Engelmaier,EngelmaierAssociates L.C.Leo G.Feinstein,Leo FeinsteinAssociateBarry R.Fernelius,AgilentTechnologiesJohn Fink,Honeywell SSECCurtis Grosskopf,IBM CorporationJoel Heebink,HoneywellTerenc

19、e Kern,Ambitech InternationalNick Lycoudes,FreescaleSemiconductorSteven R.Martell,Sonoscan Inc.Jack McCullen,Intel CorporationSean McDermott,CelesticaJames H.Moffitt,Moffitt ConsultingServQuang Nguyen,Xilinx Inc.David NicolJohn Northrup,BAE SystemsControlsLarry Nye,Texas Instruments Inc.Kerry Oren,A

20、cousTech Inc.Deepak K.Pai,C.I.D.,GeneralDynamics-Advanced InformationSystemsRichard Shook,Agere Systems Inc.Von Sorenson,Micron TechnologyInc.Alvin S.Tamanaha,Seika MachineryInc.Ralph W.Taylor,Lockheed MartinCorporationJerome Tofel,Northrop GrummanCorporationJanuary 2007IPC/JEDEC J-STD-033B.1-Includ

21、es Amendment 1iiiCopyright Association Connecting Electronics Industries Provided by IHS under license with IPCLicensee=Sanmina SCI Corp San Jose/5964569001 Not for Resale,09/26/2007 07:00:25 MDTNo reproduction or networking permitted without license from IHS-,-,-This Page Intentionally Left BlankIP

22、C/JEDEC J-STD-033B.1-Includes Amendment 1January 2007ivCopyright Association Connecting Electronics Industries Provided by IHS under license with IPCLicensee=Sanmina SCI Corp San Jose/5964569001 Not for Resale,09/26/2007 07:00:25 MDTNo reproduction or networking permitted without license from IHS-,-

23、,-Table of Contents1FOREWORD.11.1Purpose.11.2Scope.11.2.1Packages.11.3Assembly Processes.11.3.1Mass Reflow.11.3.2Localized Heating.11.3.3Socketed Components.11.3.4Point-to-Point Soldering.11.4Reliability.21.5Terms and Definitions.21.5.1Active Desiccant.21.5.2Bar Code Label.21.5.3Bulk Reflow.21.5.4Ca

24、rrier.21.5.5Desiccant.21.5.6Floor Life.21.5.7Humidity Indicator Card(HIC).21.5.8Manufacturers Exposure Time(MET).21.5.9Moisture Barrier Bag(MBB).21.5.10 Rework.21.5.11Shelf Life.21.5.12 SMD.21.5.13 Solder Reflow.21.5.14 Water Vapor Transmission Rate(WVTR).22APPLICABLE DOCUMENTS.32.1American Society

25、for Testing and Materials(ASTM).32.2Electronic Industries Alliance(EIA,JEDEC).32.3IPC Standards.32.4Joint Industry Standards.32.5Department of Defense.33DRY PACKING.33.1Requirements.33.2Drying of SMD Packages and CarrierMaterials Before Being Sealed in MBBs.43.2.1Drying Requirements-Levels 2a-5a.43.

26、2.2Drying Requirements-Carrier Materials.43.2.3Drying Requirements-Other.43.2.4Excess Time Between Bake and Bag.43.3Dry Pack.43.3.1Description.43.3.2Materials.43.3.3Labels.63.3.4Moisture Barrier Bag Sealing.63.3.5Shelf Life.64DRYING.74.1Post Exposure to Factory Ambient.74.1.1Any Duration Exposure.74

27、.1.2Short Duration Exposure.74.2General Considerations for Baking.84.2.1High Temperature Carriers.84.2.2Low Temperature Carriers.84.2.3Paper and Plastic Container Items.84.2.4Bakeout Times.94.2.5ESD Protection.94.2.6Reuse of Carriers.94.2.7Solderability Limitations.95USE.105.1Incoming Bag Inspection

28、.105.1.1Upon Receipt.105.1.2Component Inspection.105.2Floor Life.105.3Safe Storage.105.3.1Dry Pack.105.3.2Shelf Life.105.3.3Dry Atmosphere Cabinet.105.4Reflow.115.4.1Opened MBB.115.4.2Reflow Temperature Extremes.115.4.3Additional Thermal Profile Parameters.115.4.4Multiple Reflow Passes.115.4.5Maximu

29、m Reflow Passes.115.5Drying Indicators.115.5.1Excess Humidity in the Dry Pack.115.5.2Floor Life or Ambient Temperature/Humidity Exceeded.125.5.3Level 6 SMD Packages.126BOARD REWORK.126.1Component Removal,Rework and Remount.126.1.1Removal for Failure Analysis.126.1.2Removal and Remount.126.2Baking of

30、 Populated Boards.127DERATING DUE TO FACTORYENVIRONMENTAL CONDITIONS.12January 2007IPC/JEDEC J-STD-033B.1-Includes Amendment 1vCopyright Association Connecting Electronics Industries Provided by IHS under license with IPCLicensee=Sanmina SCI Corp San Jose/5964569001 Not for Resale,09/26/2007 07:00:2

31、5 MDTNo reproduction or networking permitted without license from IHS-,-,-Appendix ATest Method for Humidity IndicatorCard used with ElectronicComponent Packaging.14Appendix BDerivation of Bake Tables.15Appendix CAmendment 1-Differences betweenJ-STD-033B.1 and J-STD-033B.15FiguresFigure 3-1Typical D

32、ry Pack Configuration for Moisture-Sensitive SMD Packages in Shipping Tubes.4Figure 3-2Example Humidity Indicator Card.5Figure 3-3Moisture-Sensitive Identification Label(Example).6Figure 3-4Moisture-Sensitive Caution Label(Example).7Figure A-1Photo of Testing Apparatus.14TablesTable 3-1Dry Packing R

33、equirements.3Table 3-2Typical HIC Spot Compliance.6Table 4-1Reference Conditions for Drying Mountedor Unmounted SMD Packages.8Table 4-2Default Baking Times Used Priorto Dry-Pack that were Exposedto Conditions 60%RH(Supplier Bake:MET=24 h).9Table 4-3Resetting or Pausing the Floor Life Clockat User Si

34、te.9Table 5-1Moisture Classification Level and Floor Life.10Table 7-1Recommended Equivalent Total Floor Life(days)20C,25C&30C,35C For ICswith Novolac,Biphenyl and MultifunctionalEpoxies.13IPC/JEDEC J-STD-033B.1-Includes Amendment 1January 2007viCopyright Association Connecting Electronics Industries

35、 Provided by IHS under license with IPCLicensee=Sanmina SCI Corp San Jose/5964569001 Not for Resale,09/26/2007 07:00:25 MDTNo reproduction or networking permitted without license from IHS-,-,-Handling,Packing,Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices1 FOREWORDThe advent of

36、surface mount devices(SMDs)introduced a new class of quality and reliability concerns regarding packagedamage cracks and delamination from the solder reflow process.This document describes the standardized levels of floorlife exposure for moisture/reflow-sensitive SMD packages along with the handlin

37、g,packing and shipping requirements nec-essary to avoid moisture/reflow-related failures.Companion documents J-STD-020 and JEP113 define the classification pro-cedure and the labeling requirements,respectively.Moisture from atmospheric humidity enters permeable packaging materials by diffusion.Assem

38、bly processes used to solderSMD packages to printed circuit boards(PCBs)expose the entire package body to temperatures higher than 200C.Duringsolder reflow,the combination of rapid moisture expansion,materials mismatch,and material interface degradation can resultin package cracking and/or delaminat

39、ion of critical interfaces within the package.The solder reflow processes of concern are convection,convection/IR,infrared(IR),vapor phase(VPR)and hot air reworktools.The use of assembly processes that immerse the component body in molten solder are not recommended for mostSMD packages.1.1 PurposeTh

40、e purpose of this document is to provide SMD manufacturers and users with standardized methods forhandling,packing,shipping,and use of moisture/reflow sensitive SMD packages that have been classified to the levelsdefined in J-STD-020.These methods are provided to avoid damage from moisture absorptio

41、n and exposure to solder reflowtemperatures that can result in yield and reliability degradation.By using these procedures,safe and damage-free reflow canbe achieved,with the dry packing process,providing a minimum shelf life capability in sealed dry-bags of 12 months fromthe seal date.1.2 Scope1.2.

42、1 Packages1.2.1.1 NonhermeticThis standard applies to all nonhermetic SMD packages subjected to bulk solder reflow processesduring PCB assembly,including plastic encapsulated packages and all other packages made with moisture-permeable poly-meric materials(epoxies,silicones,etc.)that are exposed to

43、the ambient air.1.2.1.2 HermeticHermetic SMD packages are not moisture sensitive and do not require moisture precautionary handling.1.3 Assembly Processes1.3.1 Mass ReflowThis standard applies to bulk solder reflow assembly by convection,convection/IR,infrared(IR),andvapor phase(VPR)processes.It doe

44、s not apply to bulk solder reflow processes that immerse the component bodies in mol-ten solder(e.g.,wave soldering bottom mounted components).Such processes are not allowed for many SMDs and are notcovered by the component qualifications standards used as a basis for this document.1.3.2 Localized H

45、eatingThis standard also applies to moisture sensitive SMD packages that are removed or attached sin-gly by local ambient heating,i.e.,hot air rework.See Clause 6.1.3.3 Socketed ComponentsThis standard does not apply to SMD packages that are socketed and not exposed to solderreflow temperatures.Such

46、 SMD packages are not at risk and do not require moisture precautionary handling.1.3.4 Point-to-Point SolderingThis standard does not apply to SMD packages in which only the leads are heated toreflow the solder,e.g.,hand-soldering,hot bar attach of gull wing leads,and through hole by wave soldering.

47、The heatabsorbed by the package body from such operations is typically much lower than for bulk surface mount reflow or hot airrework,and moisture precautionary measures are typically not needed.January 2007IPC/JEDEC J-STD-033B.1-Includes Amendment 11Copyright Association Connecting Electronics Indu

48、stries Provided by IHS under license with IPCLicensee=Sanmina SCI Corp San Jose/5964569001 Not for Resale,09/26/2007 07:00:25 MDTNo reproduction or networking permitted without license from IHS-,-,-1.4 ReliabilityThe methods set forth in this specification ensure that an adequate SMD package reliabi

49、lity can be achievedduring and after the PCB assembly operation,when the SMD packages are evaluated and verified by J-STD-020 and/or byJESD22-A113 plus environmental reliability testing.This specification does not address or ensure solder joint reliability of attached components.1.5 Terms and Defini

50、tions1.5.1 Active DesiccantDesiccant that is either fresh(new)or has been baked according to the manufacturers recommen-dations to renew it to original specifications.1.5.2 Bar Code LabelThe manufacturers label that includes information in a code consisting of parallel bars and spacesor a 2D matrix