PCB专业术语.pdf

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1、印制电路板专业术语 印制电路板专业术语 Professional Terminology of Printed Circuit Board徐娟 徐娟 2010-02-28第2页共80页目录目录1.公司简介公司简介2.PCB设计设计3.PCB制造制造4.PCB贴装贴装5.学习与交流学习与交流第3页共80页1.公司简介公司简介1.1公司名称1.2产品类型1.3服务特点1.4部门名称深圳兴森快捷电路科技股份有限公司SHENZHEN FAST PRINT CIRCUIT TECH CO.,LTD广州兴森快捷电路科技有限公司GUANGZHOU FAST PRINT CIRCUIT TECH CO.,LT

2、D广州兴森电子有限公司GUANGZHOU FAST PRINT CIRCUIT CO.,LTD.第4页共80页公司定位国内规模最大的印制电路板样板快件及小批量板的设计、制造服务商The leading manufacturer of high-tech quick turn prototype,High mix small and medium volume PCBs in China。样板；prototypepruttaip n.原型;标准;模范快速响应Quick-turn Service1.1公司名称1.2产品类型1.3服务特点1.4部门名称1.公司简介公司简介第5页共80页产品类型Pri

3、nted Circuit Board（PCB）Sort 刚性板Rigid board 挠性板flexible board 刚挠结合板 flex-rigid board高密度互联：High Density Interconnection（HDI）金属基板：Metal base PCBIC封装基板：Integrated Circuit Package Substrate Example：高频板High Frequency PCB陶瓷印制板：Ceramic substrate printed board1.1公司名称1.2产品类型1.3服务特点1.4部门名称1.公司简介公司简介第6页共80页一站式服

4、务One-stop solution1.1公司名称1.2产品类型1.3服务特点1.4部门名称1.公司简介公司简介第7页共80页部门名称：人力资源部：Human Resource（HR）Department行政部：Administration department财务部：Financial Department 采购部：Purchase 销售部：Sales department 市场部：Market department订单管理部：Order management department生产部：Production department工艺部：Technology/craft department

5、设备/设施部：Equipment Department品质部：Quality Assurance（QA）department产品工程部：Project Engineering 生产工程部：Production Engineering技术中心：Technology Center 1.1公司名称1.2产品类型1.3服务特点1.4部门名称1.公司简介公司简介Key PerformanceIndicator（KPI）第8页共80页2.1设计术语2.2工程术语2.PCB设计（1）印刷电路板设计：）印刷电路板设计：PCB Layout面向产品生命周期各/某环节的设计：Design for X（DFX）可生

6、产设计:Design for Manufacture（DFM）可测试设计:Design for Test（DFT）为成本而设计:Design for Cost（DFC）可组装设计:Design for Assembly（DFA）可诊断分析设计:Design for Diagnosibility（DFD）可采购设计:Design for Procurement（DFP）可环保设计:Design for Environment（DFE）为PCB可制造而设计:Design for Fabrication of the PCB（DFF）可服务设计:Design for Serviceability（D

7、FS）为可靠性而设计:Design for Reliability（DFR）计算机辅助设计Computer aided design（CAD）第9页共80页2.1设计术语2.2工程术语2.PCB设计计算机辅助设计Computer aided design（CAD）（2）信号完整性：）信号完整性：Signal Integrity（SI）原理图：shematic diagram 逻辑图：logic diagram 逻辑模拟：logic simulation 电路模拟：circit simulation（3）电磁相容性：）电磁相容性：Electro Magnetic Compatibility（EM

8、C）（）（4）电源完整性设计：）电源完整性设计：Power integrity（PI）最大信号处理速率：Highest Signal Speed电子设计自动化：Electronic design automatic（EDA）第10页共80页2.PCB设计计算机辅助制造:Computer aided manufacture（CAM）2.1设计术语2.2工程术语文件预审文件制作编写流程（1）可制作性分析：Produceability Analysis（2）确定制作流程：Determination of the Manufacturing Process(Job Planning)计算机辅助制造Co

9、mputer aided manufactur（CAM）（1）优化Gerber文件：“Perfect”Gerber files（2）拼版：Array（1）制造说明：manufacture information（MI）（2）电镀面积计算：Surface area calculations for plating阻抗控制：Impedance control PCB第11页共80页资料室Film洁净房Clean Room底片检查Artwork inspection激光光绘Photoplotting复片copies for some processes The artwork or phototoo

10、lis plotted from the panelizedGerber data created in CAM.2.PCB设计2.1设计术语2.2工程术语（1）资料室（1）资料室流程流程第12页共80页2.PCB设计2.1设计术语2.2工程术语（2）设备（2）设备资料室Film激光光绘机：Laser plotter冲片机：Flim processor二次元测量仪：two dimension measuring instrument菲林检查机：Film patterm automatic inspection system光密度测量仪：transmittance meter（3）物料）物料银盐

11、片：Silver film（卤化银Silver halid）重氮片：Diazo Film（Phototool）第13页共80页2.PCB设计2.1设计术语2.2工程术语菲林：Artwork原装菲林：Artwork Film菲林修改：Artwork Modification药膜面：Emulsion Side菲林图形：Artwork Drawing光密度：Optical Density 透光度：Transmittance（T）温度：温度：Temperature 相对湿度：相对湿度：Relative Humidity重直保存底片：Vertical film storage（4）参数（4）参数资料室F

12、ilm第14页共80页3.PCB制造子板：daughter board开 料cutting内层干膜Inner layer Image内层蚀刻Inner layer EtchingAOI检查AOI Inspection棕 化Brown oxygen减薄铜Copper Reduction钻 孔Drilling埋孔电镀I.V.H.Plating树脂塞孔Resin filling/plugged陶瓷磨板Ceramic buffering 沉铜/板镀PTH/Panel Plating去离子水：DI(dialysis ion)water水洗：Rinsing 第15页共80页母板：mother board减

13、薄铜Copper Reduction激光钻孔Laser Ablation盲孔电镀I.V.H.Plating电镀填孔Microvia filling层压Lamination外层干膜Outer layer Image图形电镀Pattern Plating钻 孔Drilling沉铜/板镀PTH/Panel Plating外层蚀刻Outer layer etchingAOI检查AOI Inspection阻焊Solder Mask 字符Legend沉金ENIG阻抗测试Impedance test铣板Routing 电测Electrical Test终检Visual Inspection3.PCB制造第

14、16页共80页4.SMT（1）流程（2）类型（3）缺陷贴装机:Placement machine外观检查Visual Inspection回流焊Reflow Soldering检查Inspection丝印机印锡膏Solder Paste 贴装元件Pick and Place 发货Delivery波峰焊Wave Soldering贴装元件Pick and Place 第17页共80页4.SMT表面贴装技术:SMT(Surface mount technology)表面贴装设备:SMD(Surface mount devices)插接、插装：插接、插装：Insert、Insertion混合零件之组

15、装技术：Mixed Component Mounting Technology 双列直插封装双列直插封装:DIP(dual inline package)四面扁平封装:QFP(quad flat package)球栅封装:BGA(ball grid array)邦定:Bonding（1）流程（2）类型（3）缺陷第18页共80页4.SMT焊锡球，锡球：Solder Ball锡桥：Solder Bridging浮渣：Dross缺锡，漏焊：Skip Solder锡尖：Icicle锡点沾污：Smudging焊锡突点：Solder Projection塌散：Slump溅锡：Solder Splash（1

16、）流程（2）类型（3）缺陷冷焊：Cold Joints 不润湿：Nonwetting 反润湿：Dewetting 歪斜：Skewing 焊料上吸：Wicking 桥连：Bridging 空洞：Voiding润湿不良：Poor Wetting第19页共80页5.学习与交流附件1-4：PCB专业术语附件5：参考网址清单附件1-4：PCB专业术语附件5：参考网址清单附件5-参考网站附件1-PCB专用术语1附件2-PCB专业术语2附件3-PCB专业术语3附件4-PCB专业术语4第20页共80页5.学习与交流第21页共80页谢谢！第22页共80页产品类型PCB Sort 金属基板：metal base

17、PCB冷板heat sink PCB烧结sweat bonding PCB铝基板Aluminum base printed board铜基板Copper base printed board1.1公司名称1.2产品类型1.3服务特点1.4部门名称1.公司简介公司简介第23页共80页2.PCB设计2.1设计术语2.2工程术语Layers Count：4HDI：1+n+1Line width/spacing for inner layer（mil）：）：2/2Line width/spacing for outer layer（mil）：）：2/2Min mechanical drill size

18、（mil）：4Min Spacing between via to Conductor（mil）：5Surface Treatment：Immersion Gold计算机辅助制造:Computer aided manufacture（CAM）第24页共80页2.PCB设计2.1设计术语2.2工程术语计算机辅助制造:Computer aided manufacture（CAM）优化底片尺寸和定位：“Perfect”digital artwork panelization and alignment 增加制造日期，公司 UL 标记等：Addition of date code,UL vendor

19、code 添加测试付联条：Addition of test coupons to panels第25页共80页2.PCB设计（1）软件知识：原点-origin 镜相-mirroring 比例系数：scaling factor网络：network 绝对数据：Absolute Data 动态蚀刻补偿：动态蚀刻补偿：Dynamic Etch Compensation（DEC)（2）图形：焊盘-PAD 宽度-width 光圈-aperture 泪滴-teardrop隔离焊盘-isolation pad 热焊盘-thermal pad 反光点-Fiducial标靶：target 槽孔：slot （3）形

20、状：圆形-round 长圆形-oblong 正方形-square 长方形-rectangle（4）其他：NOPE(no process engineering)（重订单）2.1设计术语2.2工程术语计算机辅助制造:Computer aided manufacture（CAM）第26页共80页剪板机：Shearer圆角机：Corner rounding Machine/Round corner cutter铣边机：Edge milling machine烘箱：Oven千分尺：micrometer3.1开料（1）设备（2）物料（3）缺陷（4）参数第27页共80页覆铜板：Copper clad la

21、minate(CCL)电解铜箔：electrodeposited copper foil压延铜箔：rolled copper foilcopper foil3.1开料（1）设备（2）物料（3）性能（4）参数第28页共80页酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates(epoxy/paper ccl)环氧玻璃布基覆铜箔板：epoxide woven glass fabric coppe

22、r-clad laminates聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates陶瓷基覆铜箔板：ceramics base copper-clad laminates3.1开料（1）设备（2）物料（3）性能（4）参数第29页共8

23、0页玻璃态转化温度(Tg)：glass transition temperature 介电常数：Dielectric Constant（DK）损耗系数：Dissipation Factor（DF）介质强度：Dielectric Strength吸水性：Water Absorption热膨胀系数：Coefficient of thermal expansion（CTE）3.1开料（1）设备（2）物料（3）性能（4）参数第30页共80页经向：warp-wise纬向：weft-wise,filling-wise板角记号：Corner mark 烘板：Baking板厚：board thickness铜

24、箔厚度：copper foil thickness尺寸与公差：dimension and tolerance3.1开料（1）设备（2）物料（3）性能（4）参数第31页共80页定位孔:location hole 隔离孔:clearance hole元件孔:component hole 安装孔:mounting hole余隙孔:access hole 散热孔：Thermal Via导通孔：导通孔：Plated Through Hole（PTH）/Feed Through Hole无环通孔：Landless Hole盲孔盲孔:blind via 埋孔埋孔:buried via非镀通孔：Unsuppo

25、rted Hole局部层间导通孔(IVH):Interstitial Via-Holeany layer inner via hole(ALIVH)任意层内部导通孔导通孔:Via hole3.2钻孔Hole sort（1）类型（2）设备（3）物料（4）缺陷（5）参数第32页共80页数控钻机：Computer numerical control（CNC）drilling machine钻轴，主轴:Spindle压力脚：Pressure Foot钻针重磨机：Drill PointerX射线检查机：X-RAY inspector孔位精度测试机：Hole-AOI Express3.2钻孔（1）类型（2

26、）设备（3）物料（4）缺陷（5）参数第33页共80页垫板：Backup盖板：Entry Material钻刀：Drill Bits 返磨钻刀：Repoint drill-bit 套环：Ring销钉：Peg针规：Gage，Gauge孔图：hole pattern3.2钻孔（1）类型（2）设备（3）物料（4）缺陷（5）参数凿刃:Chisel钻尖切削面:Drill Facet退屑槽，退屑沟:Flute刃角磨损:Lay Back第34页共80页偏孔：hole misregistration/shift 披锋：Burr多 孔：Extra hole 漏钻孔：missing hole崩孔：Hole brea

27、kout 打孔不良：Improper targeting孔大：hole oversize 孔小：hole undersize孔未穿：Incomplete drilling 白圈、白边:Haloing孔粗糙:Hole roughness 钉头:Nail Head灯芯效应：Wicking 钻污：smear碳化物:Carbide 胶渣:Resin Smear碎屑，残材:Debris3.2钻孔（1）类型（2）设备（3）物料（4）缺陷（5）参数第35页共80页控深钻孔:Controlled Depth Drilling背钻：back drill孔密度：Hole density 孔径：Hole Diame

28、ter孔位：Hole location 孔位误差：Hole Position Tolerance孔位座标表：Hole Location Chart孔环宽度：annular ring width板厚孔径比:aspect ratioCPK：Complex Process Capability index进刀速：Infeed rate 退刀速：Retract rate 钻刀寿命：drill-life 叠板数量：Stack Number3.2钻孔（1）类型（2）设备（3）物料（4）缺陷（5）参数第36页共80页 The burr is mechanically removed using scrubb

29、ing brushes and high pressure water blast.It is a chemical metalization process intended to metallize the surface of dielectric material at the hole wall.3.3埋孔电镀 The process deposits a very thin(5-8m)copper on the entire surface of the panel and hole walls.Image transfer沉铜（PTH）Plated through hole去毛刺

30、Deburring外层电镀Panel Plating内层干膜Inner layer Image图形电镀pattern plating Buried via plating It only plate copper not tin.（1）流程（2）设备（3）物料（4）缺陷（5）参数第37页共80页除油conditioner微蚀Microetching浸酸Acid Dip预浸Pre Dip活化Activation 加速Acceleration化学铜Electroless Copper溶胀sweller凹蚀Etchback中和neutralization除胶/去钻污DesmearHole prepa

31、ration通孔准备3.3埋孔电镀（1）流程（2）设备（3）物料（4）缺陷（5）参数第38页共80页阴离子阴离子:Anion 阳离子阳离子:Cation扩散层：扩散层：Diffusion Layer3.3埋孔电镀反义词：阴极-Cathode 脉冲电镀法：Pulse PlatingThe panels are suspended in an acid-copper bath along with copper anode balls.Current from a DC rectifier drives copper to be consumed from the anodes anddeposi

32、ted on the plated surfaces.Organic compounds are also introduced to theplating baths to control deposition rates.第39页共80页自动沉铜线：Auto through hole plating line挂架:Rack3.3埋孔电镀沉铜板面电镀线：panel plating line水平电镀：Horizontal Electro-Plating垂直连续电镀：Vertiacal conveyor plating（VCP）（1）流程（2）设备（3）物料（4）缺陷（5）参数电镀去毛刺去毛刺机

33、:Scrubber第40页共80页添加剂:Addition Agent光泽剂:Brightener整平剂：Leveler/Levelling Agent 润湿剂:Wetting Agent滤芯:Cartridge3.3埋孔电镀高锰酸：Permanganate活化剂：Activator 钯：Palladium胶体：Colloid加速剂：Accelerator 螫合剂：Sequestering Agent沉铜（1）流程（2）设备（3）物料（4）缺陷（5）参数电镀第41页共80页电镀裂缝：Plating Crack电镀针孔：Plating Void渗镀：Plating seep夹膜：D/F nip3

34、.3埋孔电镀（1）流程（2）设备（3）物料（4）缺陷（5）参数第42页共80页纵横比：Aspect Ratio 电流密度：Current Density 镀通率：throwing power电镀均匀性：coefficient of variance（COV）延展性：Ductility 哈氏槽：Hull Cell活性炭处理：Carbon Treatment，Active假镀：Dummy，Dummying3.3埋孔电镀（1）流程（2）设备（3）物料（4）缺陷（5）参数第43页共80页洁净房Clean Room贴膜Dry/Wet Film Lamination前处理Pretreatment曝光Exp

35、osure显影Developing Removes the anti-tarnish coating,dirt,grease.Leaving a image in the dry film through exposure.3.4 内层干膜 Application of an UV sensitive film to the cleaned surface of the copper the unexposed soft areas of the film are dissolved away while the hardened dry film remains unaffected.（1）

36、流程（2）设备（3）物料（4）缺陷（5）参数第44页共80页PretreatmentChemical CleaningPhysical Cleaning3.4内层干膜磨板机：Scrubbing喷砂机：jet scrubbing machine火山灰磨板机：pumice scrubber（1）流程（2）设备（3）物料（4）缺陷（5）参数超音波清洗：Ultrasonic Cleaning前处理预热机：preheater贴膜机：dry film（auto/manual）cutting laminator滚涂线：Roller Coater湿压膜法：Wet Lamination贴膜第45页共80页UV(

37、ultraviolet)平行光曝光机：Collimated Exposure点光源曝光机：Scattered Exposure激光曝光机：Laser Direct Image（LDI）3.4内层干膜Exposure自动/手动：automatic/manual双面同时曝光设备：double sided simultaneous exposure equipment辐射计，光度计：Radiometer（1）流程（2）设备（3）物料（4）缺陷（5）参数曝光显影显影线：Developing Line第46页共80页附着力促进剂:Adhesion Promotor 感光启动剂：Photoinitiato

38、r粘结剂:Binder 染料:Photo ugitive光聚合反应单体:Oligomer 溶剂:impracticable湿膜：Wet Film液态光致抗蚀剂（Liquidphoto resist，LPR）Photoresist：光阻层Carrier film(PET)：聚醋盖膜（保护膜）Cover film（LDPE）：聚乙烯隔膜Dry Film3.4内层干膜（1）流程（2）设备（3）物料（4）缺陷（5）参数贴膜第47页共80页3.4内层干膜（1）流程（2）设备（3）物料（4）缺陷（5）参数监视连接元件（摄影机）:charge coupled device（CCD）碳弧灯：Carbon Ar

39、c Lamp 汞气灯：Mercury Vaper Lamp光尺：Step tablet/Step Scale/Step Wedge曝光显像液：Developer消泡剂：Anti-Foaming Agent显影第48页共80页3.4内层干膜（1）流程（2）设备（3）物料（4）缺陷（5）参数曝光显影曝光过度：Over-exposure曝光不良：Under exposure错菲林：Wrong A/W外来物，异物：Foreign Material显影不足：Under develop干膜脱落：D/F Peel off干膜碎：D/F Residue第49页共80页表面粗糙度：surface roughne

40、ss 洁净度：cleanliness 折射：Refraction解析度：Resolution光强度：Light Intensity药膜面：Emulsion Side曝光能量：exposure energy停留时间：holding time显影点：Break point(B.P.)3.4内层干膜（1）流程（2）设备（3）物料（4）缺陷（5）参数第50页共80页3.5 树脂塞孔真空塞孔机：vacuum hole plugging machine 陶瓷磨板机：ceramic buffering machine 塞孔油墨：hole plugging ink 树脂油墨：resin ink 凹陷：dimp

41、le 第51页共80页蚀刻Etching显影Developing退膜Stripping the unexposed soft areas of the film are dissolved away while the hardened dry film remains unaffected.The hardened dry film is stripped from the copper leaving the desired copper pattern reproduced from the artwork.The remaining hardened dry film on the c

42、opper acts as a“Resist”and the unprotected copper is chemically dissolved or etched.3.6内层蚀刻（1）流程（2）物料（3）缺陷（4）参数DES第52页共80页蚀刻剂：Etchant抗蚀阻剂：Etching Resist过蚀：over ecthing蚀刻不净：under etching 水池效应：Puddle Effect蚀刻因子：Etch Factor侧壁：Side Wall侧蚀：Undercut 管制下限(制程管制之用语)：Lower Control Limit（LCL）3.6内层蚀刻（1）流程（2）物料（

43、3）缺陷（4）参数第53页共80页维修Repairing检测Inspecting冲孔（PEP）Post-Etch-Punch This process punches tooling holes which are used to align inner-layer cores in subsequent processes.3.7内层检测 Inner-layer cores are inspected with theuse of a computer aided optical inspection system to locate any pattern defect that may

44、have occurred during the image transfer process.（1）流程（2）设备（3）缺陷第54页共80页3.7内层检测（1）流程（2）设备自动光学检测：Automatic Optical Inspection冲孔机：Auto registration punchAOI修理站：AOI Repair Station补线机：Wire Welder/Repair Station（3）缺陷第55页共80页品质允收水准（AQL）：Acceptable Quality Level初检良品率：First Pass-Yield主要（严重）缺陷：Major Defect开路：

45、Open/cut 缺口：Nick刮痕：Scratch 短路：Short线幼：line too thin内层偏位：I/L misregistation内层不配套：Excessive inner core露纤维：fibre exposure返工不良：Poor rework3.7内层检测（1）流程（2）设备（3）缺陷第56页共80页层压Lamination黑/棕化Black/Brown oxygen锣边、冲孔Routing、punch This will increase the bond strength between the core and the bonding materials use

46、d in the multi-layer lamination.Lamination is the process of bonding cores together to form a multi-layer panel.铆钉组合(eyelet)邦定（bonding）叠板(Lay up)3.8 层压（1）流程（2）设备（3）物料（4）缺陷（5）参数第57页共80页3.8 层压（1）流程（2）设备（3）物料（4）缺陷（5）参数棕化线：Brown oxidation line多层板压合系统：Multilayer press system数控铣床：CNC routing machine X-RAY

47、钻靶机：X-Ray Multi Drilling Machine 第58页共80页牛皮纸：Kraft Paper隔板，钢板，镜板：Caul Plate 热盘：Platen3.8 层压（1）流程（2）设备（3）物料（4）缺陷（5）参数第59页共80页分层：delamination 压痕：dent起泡：blister 邹摺：wrinkle压透，过度挤压：Print Through树脂下陷,树脂退缩：Resin Recession缺胶：Starvation白斑：Crazing 白点：Measling3.8 层压（1）流程（2）设备（3）物料（4）缺陷（5）参数第60页共80页中心不变(叠合法)：Ze

48、ro Centering多层板压合：Relamination(Re-Lam)铜箔压板法：Foil Lamination比例流量试验：Scaled Flow Test温度曲线：Temperature Profile真空压合：Vacuum Lamination胶含量,树脂含量：Resin Content多胶区：Resin Rich Area 缺胶区：Resin Starve Area剥离强度：peel strength介质层厚度：dielectric layer thickness3.8 层压（1）流程（2）设备（3）物料（4）缺陷（5）参数第61页共80页3.9 激光钻孔激光钻机：Laser d

49、rilling machine脉冲：pulse能量：energy激光直径：mask diameter（1）设备（2）参数第62页共80页蚀刻Etching退膜Stripping退锡StrippingSES水平线SES level硫脲洗Pd RemoverThiourea3.10 外层蚀刻第63页共80页丝印Silk Screen前处理Pretreatment显影Developing The solder mask is exposed to UV light in a controlled environment such as in inner or outer-layer.Removes

50、oxide and contaminants Solder mask is an insulativeprotective coating that is applied tothe external circuitry after the SES process.3.11 阻焊曝光Exposure The unexposed S/M is developedaway,leaving the solderable pads exposed.（1）流程（2）设备（3）物料（4）缺陷（5）参数第64页共80页3.11阻焊丝网印刷机：Screen Printer Machine静电喷涂：Spray