PCB板制作工艺流程介绍ppt课件.ppt

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1、HDI Manufacturing Process FlowHDI Manufacturing Process FlowPre-engineeringPattern imagingEtchingLaminatingDrillingCu platingHole pluggingPattern imagingLaminationLaser AblationMechanical drillingPattern imagingCu platingSolder MaskSurface FinishedRoutingVisual inspectionElectric testShippingPre-eng

2、ineeringPattern imagingEtchingLaminatingDrillingDesmearCu platingHole pluggingCu platingBelt SandingLaminationLaser AblationMechanical drillingCu platingPattern imagingSolder MaskGold platingRoutingElectrical testPattern imagingHole counterShippingVisual inspection* Raw material (Thin Core,Copper,Pr

3、epreg.)Raw Material Raw Material : FR-4 (Difuntional,Tetrafuntional): FR-4 (Difuntional,Tetrafuntional)Supplier Supplier : EMC ,Nan-Ya: EMC ,Nan-YaSheet sizeSheet size : 36 : 36”* *4848” , 40 , 40”* *4848” ,42 ,42”* *4848Core ThicknessCore Thickness : 0.003 : 0.003”,0.004,0.004”,0.005,0.005”,0.006,0

4、.006” 0.008 0.008”,0.010,0.010”,0.012,0.012”,0.015,0.015” 0.021 0.021”,0.031,0.031”,0.039,0.039”,0.047,0.047”Copper Foil Copper Foil : 1/3 oz,1/2 oz,1.0 oz,2 oz: 1/3 oz,1/2 oz,1.0 oz,2 ozPrepreg type Prepreg type : 1080,2113,2116,1506,7628,7630: 1080,2113,2116,1506,7628,76301.內層基板 (THIN CORE)Laminat

5、eCopper Foil裁板裁板( (Panel Size)Panel Size) COPPER FOILCOPPER FOILEpoxy GlassEpoxy GlassPhoto ResistPhoto Resist2.內層線路製作(壓膜) (Dry Film Resist Coat)Etch Photoresist (D/F)Etch Photoresist (D/F)Photo ResistPhoto Resist3. 內層線路製作(曝光)(Expose)A/WA/WArtworkArtwork( (底片底片) )ArtworkArtwork( (底片底片) )After Expose

6、After ExposeBefore ExposeBefore Expose4. 內層線路製作(顯影)(Develop)Photo ResistPhoto Resist5. 內層線路製作(蝕刻)(Etch)Photo ResistPhoto Resist6. 內層線路製作(去膜)(Strip Resist)7.黑氧化 ( Oxide Coating)8. 疊板 (Lay-up)LAYER 2LAYER 3LAYER 4LAYER 5LAYER 1LAYER 6Layer 1Layer 1Layer 2Layer 2Layer 3Layer 3Layer 4Layer 4Copper FoilC

7、opper FoilInner LayerPrepreg(膠片)Prepreg(膠片)9. 壓合 (Lamination)典型之多層板疊板及壓合結構典型之多層板疊板及壓合結構.COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZThin Core ,FR-4Thin Core ,FR-4prepreg prepreg COMPCOMPS0LD.S0LD.prepreg prepreg Thin Core ,FR-4Thin Core ,FR-4prepreg prepreg COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZ疊合用之鋼板疊合用之鋼板疊合

8、用之鋼板疊合用之鋼板10-1210-12層疊合層疊合壓合機之熱板壓合機之熱板壓合機之熱板壓合機之熱板COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZThin Core ,FR-4Thin Core ,FR-4prepreg prepreg COMPCOMPS0LD.S0LD.prepreg prepreg Thin Core ,FR-4Thin Core ,FR-4prepreg prepreg COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZ疊合用之鋼板疊合用之鋼板疊合用之鋼板疊合用之鋼板墊木板鋁板10. 鑽孔 (Drilling)11. 電鍍

9、Desmear & Copper Deposition12. 塞孔(Hole Plugging)13. 去溢膠 (Belt Sanding)14. 減銅 (Copper Reduction) Option15. 去溢膠 (Belt Sanding) Option16. 外層壓膜 Dry Film Lamination (Outer layer)Photo Resist17. 外層曝光 ExposeUV光源18. After Exposed19. 外層顯影 Develop20. 蝕刻 Etch20. 去乾膜 Strip Resist21.壓合 (Build-up Layer Lamination

10、)RCCRCC( (R Resin esin C Coated oated C Copper foil)opper foil)21. 護形層製作 (壓膜)(Conformal Mask)Dry FilmDry Film( (乾膜乾膜) )Dry FilmDry Film( (乾膜乾膜) )ArtworkArtwork( (底片底片) )ArtworkArtwork( (底片底片) )22. 護形層製作 (曝光)(Conformal Mask)Before ExposureAfter Exposure23.護形層製作 (顯像)(Conformal Mask)24. 護形層製作 (蝕銅) (Con

11、formal Mask)25.護形層製作(去膜) (Conformal Mask)26. 雷射鑽孔 (Laser Ablation)及機械鑽孔Mechanical DrillMechanical Drill(P.T.H.)(P.T.H.)Laser Microvia(Blind Via)27. 機械鑽孔 (Mechanical Drill)28. 電鍍(Desmear & Copper Deposition)29. 外層線路製作 (Pattern imaging)壓膜壓膜( (D/F Lamination)D/F Lamination) 曝光曝光( (Exposure)Exposure)顯像顯

12、像( (D/F Developing)D/F Developing) 蝕銅蝕銅 ( (Etching)Etching)去膜去膜( (D/F Stripping)D/F Stripping) 30. 防焊(綠漆)製作 (Solder Mask)WWEI94V-0R10531. S/M 顯像 (S/M Developing)32. 印文字 (Legend Printing)33. 浸金(噴錫)製作(Electroless Ni/Au , HAL)WWEI94V-0R105WWEI94V-0R105Dedicate or universal Tester Dedicate or universal

13、Tester Flying Probe Tester Flying Probe Tester 34. 成型 (Profile)35. 測試 (Electrical Testing)WWEI94V-0R105WWEI94V-0R10536. 終檢 (Final Inspection)37. O.S.P. (entek plus Cu_106A.) OptionLASER BLIND & BURIED VIA LAY-UPLASER BLIND & BURIED VIA LAY-UPA = THROUGH VIA HOLE (導通孔導通孔) B = BURIED VIA HOLE (埋孔埋孔)C

14、= One Level Laser Blind Via (雷射雷射盲孔盲孔 ) LASER BLIND & BURIED VIA LAY-UPLASER BLIND & BURIED VIA LAY-UPBURIED VIABURIED VIA ANDAND LASER LASER BLIND VIA OPTION (BLIND VIA OPTION (雷射雷射盲埋孔之選擇盲埋孔之選擇) )D DC CC CD = Two Level Laser Via (雷射雷射盲孔盲孔 ) C CD DC CB-STAGEB-STAGEFR-4 CoreRCCRCCFR-4 CoreB-STAGEB-ST

15、AGERCCRCCA AB BB BA ABURIED VIA LAY-UPBURIED VIA LAY-UPA = THROUGH VIA HOLE (導通孔導通孔) B = BURIED VIA HOLE (埋孔埋孔)C = BLIND VIA HOLE (盲孔盲孔 ) D = BLIND HOLE MLB VIA (多層盲孔多層盲孔)BLIND VIA LAY-UPBLIND VIA LAY-UPBLIND VIA SEQUENTIAL LAY-UPBLIND VIA SEQUENTIAL LAY-UPA AB BB BA AR RE ES SI IN NB-STAGEB-STAGE B

16、LIND AND BURIED VIA OPTION (BLIND AND BURIED VIA OPTION (盲盲 埋埋 孔孔 之之 選選 擇擇 ) )D DA AC CC C E = VIA IN PAD (VIP) (導通孔在導通孔在pad裡面裡面)E EConventional PCBFR-4Build-upLayerBuild-upLayerPhoto-viaPhoto-Imageable Dielectric (PID)FR-4Conventional PTHConventional PTHConventional PCBBlind Via PCBPTH3 mil lineSVHIVHChip-on-SVHFR-4Conventional PTHConventional PTH