2022年IPC标准对照 .pdf

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1、IPC-M-105 Rigid Printed Board Manual 刚性印制板设计手册IPC-D-325A Documentation Requirements for Printed Boards 印制板设计文件图册要求IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly 印制板制造和组装的故障排除 IPC-6010 Series IPC-6010 Qualification and Performance Series IPC-6010印制电路板质量标准和性能规范系列手册 IPC-6011 Gen

2、eric Performance Specification for Printed Boards 印制板通用性能规范 IPC-6013A Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 挠性印制板的鉴定与性能规范（包括修改单1） IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连 (HDI)

3、 层或印制板的鉴定与性能规范 IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 刚性印制板的鉴定与性能规范 ( 包括修改单1) IPC-6018A Microwave End Product Board Inspection and Tech 微波成品印制板的检验和测试 IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-

4、L) Mounting and Interconnections 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范 IPC-A-600F Acceptability of Printed Boards 印制板验收条件 IPC-QE-605A Printed Board Quality Evaluation Handbook 印制板质量评价 IPC-QE-605A-KIT Hard Copy and CD 印制板质量评价书和光盘(CD) IPC-HM-860 Specification for Multilayer Hybrid Circuits 多层混合电路规范 IPC-TF-870

5、 Qualification and Performance of Polymer Thick Film Printed Boards 聚合物厚膜印制板的鉴定与性能 IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 1 页，共 6 页 - - - - - - - - - for Multilayer printed Boar

6、ds 多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范 IPC-TR-481 Results of Multilayer Tests Program Round Robin 多层印制板联合试验计划结果 IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 用于电子元件安装与互连的印制板质量评价 IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Pl

7、ated Through Holes in PCBs 印制板中小直径镀覆孔可靠性评价联合试验 IPC-4552 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards 印制电路板表面非电镀镍/ 沉金规范 IPC-DR-572 Drilling Guidelines for Printed Boards 印制板钻孔导则 IT-95080 Improvements/Alternatives to Mechanical Drilling of PCB Vias 印制板通孔

8、机加工方案的改进和优选手册 IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers 钻床和铣床用计算机数字控制格式 IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines 施加阻焊前及施加后清洗导则 IPC-HDI-1 High Density Interconnect Microvia Technology Compendium 高密度 (HDI) 互连微通孔技术纲要 IPC/JPCA-4104 Specification f

9、or High Density Interconnect (HDI) and Microvia Materials 高密度互连 (HDI) 及微导通孔材料规范 IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连 (HDI) 层或印制板的鉴定与性能规范 IPC/JPCA-6801 IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up

10、/High Density Interconnection 积层 / 高密度互连的术语和定义、试验方法与设计例名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 2 页，共 6 页 - - - - - - - - - IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 多芯片组件内层有机绝缘材料的鉴定试验IT-96060 H

11、igh Density PCB Microvia Evaluation (October Project), Phase I, Round 1 高密度印制板微通孔评价指标手册, 第一期第一版 IT-97071 High Density PCB Microvia Evaluation, Phase I, Round 2 高密度印制板微通孔评价指标手册, 第一期第二版 IT-30101 High Density PCB Microvia Evaluation, Phase I, Round 3 高密度印制板微通孔评价指标手册, 第一期第三版 IT-98123 Microvia Manufactur

12、ing Technology Cost Analysis Report 微通孔制作技术成本核算报告 IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design 控制阻抗电路板与高速逻辑设计 IPC-2252 Design Guide for RF/Microwave Circuit Boards 射频 / 微波电路板设计指南 IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications 高速高频用基材规范

13、IPC-6018A Microwave End Product Board Inspection and Test 微波成品印制板的检验和测试 IPC-D-317A Design Guidelines for Electronic Packaging Utilizing High Speed Techniques 采用高速技术电子封装设计导则 IPC-M-102 Flexible Circuits Compendium 挠性电路纲要 IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry 挠性印制线路用挠

14、性绝缘基底材料 IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films 挠性印制线路覆盖层用涂粘接剂绝缘薄膜 IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry 挠性金属箔去电应用于柔性电路组装名师资料总结 - - -精品资料欢迎下载 - - - - -

15、 - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 3 页，共 6 页 - - - - - - - - - IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards & Amendment 1 挠性印制板的鉴定与性能规范（包括修改单1） IPC/JPCA-6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boar

16、ds IPC/JPCA单双面挠性印制板性能手册 IPC-FA-251 Guidelines for Assembly of Single- and Double-Sided Flex Circuits 单面和双面挠性电路组装导则 IPC-FC-234 Composite Metallic Materials Specification for Printed Wiring Boards 印制线路板复合金属材料规范 IPC-MB-380 Guidelines for Molded Interconnection Devices 模压互连器件导则 IPC-M-107 Standards for P

17、rinted Board Materials Manual 印制板材料标准手册 IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收检验手册 IPC-4101A Specifications for Base Materials for Rigid and Multilayer Printed Boards 刚性及多层印制板用基材规范 IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applicati

18、ons 多层印制板用芯板结构选择导则 IPC-4562 Metal Foil for Printed Wiring Applications 印制线路用金属箔 IPC-CF-148A Resin Coated Metal for Printed Boards 印制板用涂树脂金属箔 IPC-CF-152B Composite Metallic Materials Specification for Printed Wiring Boards 印制线路板复合金属材料规范 IPC-TR-482 New Developments in Thin Copper Foils 薄铜箔的新发展 IPC-TR-

19、484 Results of IPC Copper Foil Ductility Round Robin Study IPC 铜箔延展性联合研究结果 IPC-TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 4 页，共 6 页 - - - - - - - - - 铜箔断裂强度试验联合研究结果 IPC- 4412 Specification for

20、Finished Fabric Woven from ”E” Glass for Printed Boards “E”类精纺玻璃纤维层印制板技术规范 IPC-4130 Specification & Characterization Methods for Nonwoven E Glass Materials E 玻璃纤维非织布材料规范及性能确定方法 IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards 印制板用纤维纸规范及性能确定方法

21、IPC-4411-K Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1 聚芳基酰胺非织布规范及性能确定方法, 包括修改单 1 IPC-4411-AM1 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1 关于聚芳基酰胺非织布规范及性能确定方法的修改单 1 IPC-SG-141 Specification f

22、or Finished Fabric Woven from S Glass for Printed Boards 印制板用经处理S玻璃纤维织物规范 IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards 印制板用经处理聚芳酰胺纤维编织物规范 IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 印制板用经处理石英（熔融纯氧化硅）纤维编织物规范

23、 IPC-2524 PWB Fabrication Data Quality Rating System 印制板制造数据质量定级体系 IPC-9151A Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database 印制板工艺 , 容量 , 质量 , 可靠性试验标准和数据库 IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) 实施统计

24、过程控制(SPC) 的通用导则 IPC-9199 Statistical Process Control (SPC) Quality Rating 统计分析控制名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 5 页，共 6 页 - - - - - - - - - IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 未组装印制板电测试要求和指南 IT-9706

25、1 PWB Hole to Land Misregistration: Causes and Reliability 印制线路板通孔与焊盘的错位: 原因和可靠性 IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels 多层板内部无焊盘层互连错位的可靠性 IPC-MS-810 Guidelines for High Volume Microsection 大批量显微剖切导则 IPC-QL-653A Certification of Facilities that Ins

26、pect/Test Printed Boards, Components & Materials 印制板、元器件及材料检验试验设备的认证 IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test 薄层压板尺寸稳走性试-国际联合试验计划I 阶段及 II阶段报告 IPC-TR-486 Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation 内层分离的互连应力测试(IST)与显微剖切相关性联合研究名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 6 页，共 6 页 - - - - - - - - -