PCBA检验规范 .docx

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1、精品名师归纳总结封面可编辑资料 - - - 欢迎下载精品名师归纳总结作者： PanHongliang仅供个人学习PCBA检验规范编号：版本： V1.0生效日期：可编辑资料 - - - 欢迎下载精品名师归纳总结1. 修订情形表版本说明修订历史作者审核批准生效日期2 术语表术语表名称说明可编辑资料 - - - 欢迎下载精品名师归纳总结目录1. 目的 PURPOSE12. 范畴 SCOPE13. 名词说明 WORDS EXPLANATION14. 参考文件 REFERENCE DOCUMENT15. 职责RESPONSIBILITY . 16. 作业流程及内容Flowchartandconte nt

2、 . .17.修订权限 AUTHORITY OFMODIFICATION28.附件ATTACHMENT .28.1附件PCBA.4一8.2 附件二机构类.428.3 附件三其它 .52PCBA检验规范1 目的 Purpose建立产品外观目视检验标准, 使产品检验之判定有所依循, 同时藉由检验资料的回馈分析建立良好的 workmanship,防止不良之发生 .To establishthestandardinspectionofproductcosmeticforoperationtofollow,and establish well workmanship by feedback and an

3、alyzing the inspection document to voidfailure.2 范畴 Scope本规范适用于全部产品 含半成品及成品PCBA 的外观目视检验, 包含自行生产制造之PCBA, 托付外包生产制造之PCBA, 以及外购入厂组立或单独包装出货之PCBA 等. It fits all productcontaining product and PCBA appearance inspection, including PCBA made by self or by other company and other.3 名词说明 Words explanation无None

4、可编辑资料 - - - 欢迎下载精品名师归纳总结4 参考文件 Reference documentANS/IPC-A-610D5 职责 Responsibility5.1 生产单位 Production unit:负责产品检验之执行.Be responsible for doing product inspection5.2 质量治理部 Quality unit:负责产品规格之制定及产品品质之抽样检验管制 Be responsiblefor making product specificationand controllingthe spot check of product quality6

5、 作业流程及内容 Flow chart and content 6.1 检验前的预备 preparation for inspecting:检验前须先确认所使用的工具,材料 , 胶,清洁剂等 ,是否合乎规定. 检验PCBA 时必需配戴防静电手套或防静电手环, 而成品有外壳部分就不在此限.Beforeinspecting,be sureof the tool,material,glue,cleanser,etc. Operator shouldhavewriststrapor electrostaticgloveforpreventionESDElectronicstatic Discharge

6、 , but the finished good with。6.2 如有检验标准未规范的反常现象发生时，不代表该产品允收或拒收，应向值班工程师询问。 It is not meansthe product accept or rejectthat thestandard of inspection have some abnormal , but should feed back to engineer to confirm.6.3 检验环境要求光线充分 ,以目视为主 ,辅以放大镜和卡尺6.4外观检验工程基准参见附件一三。 Theitemof cosmeticinspectionstandard

7、 reference Appendix 1 to 3.7 修订权限 Authority of modification本规范由质量治理部工程师撰写,经研发单位及生产单位会签,由质量治理部最高主管 核准后实施 , 修改程序亦同.Thiscriteriais preparedby Qualityunitengineerand signed off with R&DResearch and Develop department and Production unit, andthen approve by Quality manager. Modify procedure as the same a

8、bove.8 附件 Attachment 含记录表单 8.1 附件一： PCBA Appendix 1: PCBA可编辑资料 - - - 欢迎下载精品名师归纳总结8.2 附件二：机构类 Appendix 2: Mechanical8.3 附件三：其它 Appendix 3: Other附件一: PCBA 类附件二:机构类Mechanical附件三:其它Other1 SMT零件SMT component1-1 焊点规格 Soldering SPEC1-2 焊点反常 Soldering abnormal1-3 零件损坏 Component damage1-4 点胶 Staking adhesive

9、 gluing2 Dip零件DIP component2-1 焊点规格 DIP SPEC2-2 引 脚 突 出 Lead protrusion2-3 通孔 PTH2-4 插件外观 Appearance 2-5 点胶 Adhesive gluing2-6 DIP 高翘 DIP componentlifted3PCB 3-1 marking3-2外观 Surface appearance1 外壳 Housing2 托架 ,承座 Chassis 3 铭板 Overlay4 散热片 Heat sink 5 绝缘片 Insulator6 螺丝 ,螺帽 ,垫片 Screw nut7 DC series c

10、onverter系列成品外观检验标准8 Transformer9 Shielding cover外观检验标1 标签 Label2 Barcode3 包装袋 PE bag 4 外箱 Carton5 Housing3-3焊锡性 Solderability4Connector, PIN &金手指Golden finger准5 其它 Other5-1 螺丝 Screw5-2 跳线 Jump附件一: PCBA 类1 SMT 零件SMT component1-1 焊点规格 Soldering SPEC1-1-1 Chip零件 Chip component附件预览总表可编辑资料 - - - 欢迎下载精品名师

11、归纳总结DefectSideoverhangDisgreaterthan50%component termination width W or 50% land width P whichever isless零件偏移 D50% W或 D50% P拒收DefectSideoverhangDisgreaterthan50%component termination width W or 50% land width P whichever isless零件偏移 D50% W或 D50% P拒收DefectAny end overhang B零件超出 pad 拒收DefectComponent i

12、n reserved to lacquer to go to circuit to form a short circuit零件在有爱护漆之线路上造成短路拒收AcceptableEndjointwidthCisminimum50%ofcomponent termination width W or 50% land width P whichever isless零件焊点宽度 C50%W or C50% P允收AcceptableMaximum fillet height E may overhang the lend or extend onto the of the end cap met

13、allization, but not extend further onto the component body锡精湛过金属端 ,但未延长至零件本体允收可编辑资料 - - - 欢迎下载精品名师归纳总结DefectSolder fillet extends onto the component body锡延长到零件本体上拒收DefectMinimumfillethighFis lessthan25%termination high H, or fillet high F is less than 0.5mmHighvoltagecapacitanceminimumfillethighFis

14、less than 50% termination high H, or fillet high F isless than 0.75mm爬锡高度 F25% H或 F0.5mm拒收高压电容爬锡高度F50% H或 F50% W or 50% P. 拒收可编辑资料 - - - 欢迎下载精品名师归纳总结DefectAny end overhang B零件超出 pad 拒收AcceptableEndjointwidthCisminimum50%component diameter W or land width P,whichever is less零件连接直径宽度C 50% W or 50% P允收

15、AcceptableSidejointlengthDisminimum50%lengthof component terminationT or land lengthS, whicheveris less侧面焊点长度D 50%T or 50%S允收可编辑资料 - - - 欢迎下载精品名师归纳总结AcceptableMinimum fillet heithtF is solder thicknessG plus 25% diameterW of the component end cap焊锡高度 F 25%G+W允收AcceptableEnd overlapJ between the comp

16、onent termination and the land is minimum 50% the length of the component terminationT零件末端与 PAD 重叠部分 J 50%T允收DefectEndoverlapJislessthan50%ofthelengthof component零件末端与 PAD 重叠部分 J50% W拒收DefectEnd joint widthC is less than50% castellation width W零件末端焊点宽度C50% W拒收可编辑资料 - - - 欢迎下载精品名师归纳总结Minimum side joi

17、nt length D is less than 50% minimum fillet height F or land length external to package S,whichever is less零件末端焊点长度D50% S或 50% F 拒收DefectMinimum fillet height F is 25% castellation height H焊锡高度 F25% H拒收DefectAny end overhang B零件超出 pad 拒收DefectMinimum fillet height F is 25% castellation height H焊锡高度

18、F50% W拒收DefectMinimum end joint width C is less 50% lead Width W焊点宽度 C50% W拒收DefectSide joint lengthD is less than 80% of lead length L焊锡长度 D4/5 L拒收DefectSoldertouchesthebodyorendsealofhigh-lead configuration component焊锡延长至零件本体上或封装末端拒收Acceptable爬锡高度 : Fillet接触到正面吃锡面允收DefectSolder touches package bod

19、y锡延长到零件本体上拒收可编辑资料 - - - 欢迎下载精品名师归纳总结AcceptableTransformerhighvoltagepin ssolderisovertheA cornerportion,butex no functionpin for all inverters, except special case变压器高压 Pin 吃锡度已达到 A 处第一弯角处 允收AcceptableSolderisovertheBportionforallinverters,except special case吃锡度超出 B 处允收DefectSolderis alreadyovertheB

20、 portion,andbobbinhad Been damaged by iron .Bobbin被烙铁烫伤拒收DefectMinimumheelfilletheightFislessthan25%lead thickness T焊锡高度 F50% W拒收DefectMinimumendjointwidthCislessthan50%lead width/diameter W焊锡宽度 C50% W拒收DefectSide joint length D is less than 80% lead length焊锡长度 D 小于 4/5 引脚长度拒收可编辑资料 - - - 欢迎下载精品名师归纳总

21、结Solder touches the package or end seal焊锡延长至零件本体上或封装末端拒收DefectMinimum side joint height Q is less than solder thickness G plus 50% diameter W of round lead or 50% thickness of lead at joint side T for coined lead焊锡高度 QG+50% W or Q50% W拒收AcceptableMinimum end joint width C is 50% lead width W焊锡宽度 C 5

22、0%W 允收DefectSide joint fillet D less than 150% lead width焊锡宽度 D 小于 150% 引脚宽度 W 拒收可编辑资料 - - - 欢迎下载精品名师归纳总结Solder fillet touches package body焊锡延长至零件本体上拒收可编辑资料 - - - 欢迎下载精品名师归纳总结1-1-7 I 形引脚 Butt/I JointsDefectAny toe overhang B侧边突出拒收DefectEnd joint width C is less than 75% lead width W焊锡宽度 C75%W拒收Defec

23、tSolder touches package body焊锡延长至零件本体上拒收DefectFillet height F is less than 0.5mm0.02inch焊锡高度 F 小于 0.5mm 拒收可编辑资料 - - - 欢迎下载精品名师归纳总结1-1-8 向内 L 型引脚 Inward formed L-shaped ribbon leadsDefectEndjointwidthCislessthan50%lead withWSide overhangA is greater than 50%WMinimum fillet heightF is less than 25% E焊

24、锡宽度 C50%W 拒收焊锡高度 F25% 拒收可编辑资料 - - - 欢迎下载精品名师归纳总结AcceptableMinimumend jointwidthCis greaterthan50%lead withW焊锡宽度 C 50%W允收可编辑资料 - - - 欢迎下载精品名师归纳总结1-1-9 BGA零件 Area array/Ball grid array DefectMore than 50% overhang偏移 50%拒收Defect Solder bridge 锡桥拒收Darkspotsin X-Rayviewthebridgebetweensolder joints在 X-Ra

25、y 下焊点间桥接或拒收Solder open 锡散开拒收Missing solder 漏锡拒收Solder ballS that bridge more than 25% of the distance between the leads锡珠超出焊点间距25% 拒收DefectFracture solder connection锡裂拒收可编辑资料 - - - 欢迎下载精品名师归纳总结1-2 焊点反常 Soldering abnormal可编辑资料 - - - 欢迎下载精品名师归纳总结1-2-1 侧立 Mounting on sideDefectChip resistance mounting

26、on side电阻侧立拒收AcceptableChipcapacitance& Inductanceminimumtypeis less than 1206, mounting on side and no more than five5chip on each assembly are mounted side ways电容 ,电感类零件小于1206 含 以下 , 且单面少于5pcs允收可编辑资料 - - - 欢迎下载精品名师归纳总结可编辑资料 - - - 欢迎下载精品名师归纳总结1-2-2 翻件 Mounting upside downAcceptableElementof chipcom

27、ponentwithexposeddeposited electricalElement is mounted toward board能导通允收可编辑资料 - - - 欢迎下载精品名师归纳总结可编辑资料 - - - 欢迎下载精品名师归纳总结1-2-3 墓碑 TombstoneDefectChipcomponentstandingontheirterminal endTombstone墓碑拒收可编辑资料 - - - 欢迎下载精品名师归纳总结1-2-4 共平面 Coplanarity可编辑资料 - - - 欢迎下载精品名师归纳总结DefectOne lead or series of leads

28、 on component is out alignment and fails to make proper contact with the land零件的一个或多个引脚变形，不能与 pad 正常接触拒收可编辑资料 - - - 欢迎下载精品名师归纳总结1-2-5 锡未完全熔化 Reflow not completeDefectIncomplete reflow of solder paste锡未完全熔化拒收可编辑资料 - - - 欢迎下载精品名师归纳总结可编辑资料 - - - 欢迎下载精品名师归纳总结1-2-6 空焊 NonwettingDefectSolder has not wette

29、d to the land or termination空焊拒收可编辑资料 - - - 欢迎下载精品名师归纳总结可编辑资料 - - - 欢迎下载精品名师归纳总结1-2-7 冷焊 Dewetting, Disturbed solderDefectCharacterizedby stresslinesfrommovementin the connection while solidifying冷焊拒收可编辑资料 - - - 欢迎下载精品名师归纳总结可编辑资料 - - - 欢迎下载精品名师归纳总结1-2-8 锡裂 Fractured solderDefectFractured or crack so

30、lder焊锡断裂或破裂拒收可编辑资料 - - - 欢迎下载精品名师归纳总结1-2-9 针孔 /吹孔 Pinholes/Blowholes可编辑资料 - - - 欢迎下载精品名师归纳总结DefectBlowholes, pinholes, voids, etc焊锡连接显现气泡,气泡 ,空白,流出物等拒收Acceptable焊点上紧临零件脚的气孔/ 针孔 ,一个焊点只答应有一个,且其大小须小于零件脚面积的1/4允收Acceptable焊点上未紧临零件脚的气孔/针孔 ,一个焊点容许有不超过两个 含, 且其大小须小于零件脚面积的1/4 允收可编辑资料 - - - 欢迎下载精品名师归纳总结1-2-10

31、锡桥短路 Solder bridgeshortDefectA solderconnectionacrossconductorsthatshouldnotbe joined锡桥 短路 拒收AcceptableOn the same PAD, solder bridgeshort across conductors同 PAD 上两焊点短路允收On the same traceVisualization but not same PAD, solder bridgeshort across conductors目视同线路不同 PAD 短路允收可编辑资料 - - - 欢迎下载精品名师归纳总结1-2-1

32、1 锡珠 Solder ball可编辑资料 - - - 欢迎下载精品名师归纳总结DefectSolder ball dislodge非附着性锡珠拒收Entrappedorencapsulatedsolderballsthat are exceed 0.2mm in diameter附着性锡珠但锡珠直径大小为0.2mm （含）以上变压器高压端及高压电容旁有附着性锡珠拒收 Solderballattachedonhighvoltagesideof transformer or around high voltage capacitorMorethan5 solderballsdiameterles

33、sthan 0.2mm per 600mm2锡珠直径大小为0.2mm以下但锡珠数量多于5颗 / 6 平方公分（含）拒收PS: 锡珠以静电毛刷刷不掉者,判为附着性锡珠可编辑资料 - - - 欢迎下载精品名师归纳总结1-2-12 锡渣 Solder splashDefectSolder splashes that are exceed 0.2mm in length锡渣长度最长边0.2mm （含）以上拒收Soldersplashesattachedonhighvoltagesideof transformer or around high voltage capacitor变压器高压端及高压电容旁

34、有锡渣拒收Morethan5soldersplashesdiameterlessthan 0.2mm per 600mm2锡渣直径大小为0.2mm 以下但锡渣数量多于5 颗 / 6平方公分（含）拒收PCB 铜箔 PAD 沾锡直径大于 0.7MM 拒收可编辑资料 - - - 欢迎下载精品名师归纳总结可编辑资料 - - - 欢迎下载精品名师归纳总结1-3 零件损坏 Component damage1-3-1 裂缝与缺口 Cracks and chip-outsAcceptableCracksor chip-outsnot greaterthandimensionsL50%, W25%, T25%缺

35、口的尺寸 L50%, W25%, T25%可接受可编辑资料 - - - 欢迎下载精品名师归纳总结Any nick or chip-out that exposes the electrodes任何电极上的裂缝或缺口拒收Cracks, nicks or any type of damage bodied components玻璃组件本体上的裂缝、刻痕或任何损耗拒收Any chip-outs in resistive elements任何电阻质的缺口拒收Any cracks or stress fractures任何裂缝或压痕拒收可编辑资料 - - - 欢迎下载精品名师归纳总结1-3-2 金属镀层 Metal